Micro-Differential Pressure Sensor Testing With Capacitive Simulation

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Solution Overview

Problem

The testing capacity for MEMS chip micro-differential pressure products is limited, and airflow testing requires significant equipment and costs, posing a challenge as market demand increases.

Innovation Solution

A micro-differential pressure sensor with a MEMS chip design that includes a substrate, diaphragm, and back-pole plate, utilizing electrode regions to form capacitors, and a packaging structure with electrical connections for voltage excitation, allowing deformation simulation to determine chip degradation via capacitance changes, replacing traditional airflow testing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If airflow testing is used to test MEMS chip micro-differential pressure products, then testing accuracy is maintained, but testing capacity is limited and equipment costs increase

Engineering Contradiction:
Improvetesting capacityVSAvoidequipment requirements
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent replaces the traditional airflow testing method (mechanical system requiring complex equipment) with an electrical testing method. By applying voltage to the first electrode to drive diaphragm deformation and measuring capacitance changes between the second electrode and diaphragm, the system achieves testing without requiring actual airflow equipment, thereby increasing testing capacity while reducing equipment complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the testing parameter from physical airflow to electrical voltage and capacitance measurements. By applying different voltage signals to the first electrode and measuring the resulting capacitance changes, the system can infer diaphragm deformation characteristics without needing actual airflow conditions, thus simplifying the testing equipment while maintaining testing effectiveness

Inventive Principle:
Principle #35Parameter changes

2Reliability

If airflow testing is implemented, then product quality is verified, but testing costs increase significantly

Engineering Contradiction:
Improveproduct quality verificationVSAvoidtesting costs
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent substitutes expensive airflow testing equipment with simple electrical testing components. By using voltage excitation and capacitance measurement circuits to verify diaphragm functionality, the system maintains product quality verification capability while dramatically reducing testing costs and energy consumption

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent creates an electrical model that copies the physical deformation behavior of the diaphragm. By measuring capacitance changes that correspond to diaphragm displacement under voltage, the system verifies product quality through an electrical analogue rather than actual airflow testing, reducing costs while maintaining reliability

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides efficient and stable testing with high sensitivity and reduced equipment needs, determining chip degradation accurately using preset thresholds, enhancing test efficiency and reducing costs.

Implementation Method 1

the first electrode and the third electrode form a first capacitor, and the second electrode and the third electrode form a second capacitor

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

the first electrical connection end is configured to provide a voltage excitation signal or a high voltage signal... applying a high voltage signal to the first electrode, cause the diaphragm to deform based on the high voltage signal

Methodology Applied
Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentUS20250282611A1Micro-differential pressure sensor, packaging structure, testing method and electronic device
Publication Date: 2025.09.11 MEMSENSING MICROSYST SUZHOU CHINA
  • US20250282611A1 patent drawing
  • US20250282611A1 patent drawing
  • US20250282611A1 patent drawing

AI summary

Disclosed a micro-differential pressure sensor, a package structure, a test method, and an electronic device. The micro-differential pressure sensor comprises a MEMS chip, the MEMS chip comprises a substrate, a diaphragm, and a back-pole plate set in a laminated manner, the substrate having a back cavity which passes through in the thickness direction thereof, the back-pole plate comprises a first electrode region and a second electrode region isolated from each other, the first electrode region forming a first electrode, the second electrode region forming a second electrode, and the diaphragm forming a third electrode, the first electrode and the third electrode form a first capacitor, the second electrode and the third electrode form a second capacitor.