Differential Temperature Sensor With Insulating Support Member

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Solution Overview

Problem

Existing differential temperature sensors face challenges in integration with other components due to complexity and thermal losses, which affect the thermal gradient and correct operation, especially in miniaturized applications like microelectronics and smart buildings.

Innovation Solution

A differential temperature sensor design featuring a thermally insulating support member with metallic connection pins for both electrical and thermal conduction, integrated into an external housing that minimizes thermal bridges and allows for orthogonal temperature measurement, reducing thermal losses and enhancing mechanical strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the sensor is directly integrated into a housing or circuit, then manufacturing complexity increases and thermal losses occur, but integration is achieved

Engineering Contradiction:
Improveintegration easeVSAvoidthermal losses
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

A support member is introduced as an intermediary component between the sensor and the housing/circuit. This support member provides mechanical support and electrical connection while being thermally insulating, thereby preventing direct thermal contact that would cause thermal losses. The support member acts as a mediator that enables integration without compromising thermal performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If the sensor is directly integrated into a housing, then integration is achieved, but thermal gradient accuracy deteriorates due to thermal losses

Engineering Contradiction:
Improveintegration capabilityVSAvoidthermal gradient accuracy
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The support member serves as a thermal barrier between the sensor and the housing, preventing unwanted thermal conduction that would distort the thermal gradient. This intermediary structure maintains the integrity of the thermal gradient across the sensor while still enabling mechanical integration into the housing or circuit assembly.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If conventional integration methods are used, then device complexity increases, but integration is achieved

Engineering Contradiction:
Improveintegration capabilityVSAvoidintegration complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The support member is designed to perform multiple functions simultaneously: providing mechanical support for the sensor, establishing electrical connections through conductive elements, and preventing thermal conduction through its insulating properties. This multi-functional design simplifies the overall integration process by consolidating multiple requirements into a single component rather than requiring separate elements for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables efficient thermal gradient reflection between the hot and cold sources, reducing thermal losses and maintaining accurate temperature measurements while integrating the sensor directly into an integrated circuit package, thus improving operational reliability and mechanical strength.

Implementation Method 1

The output voltage V generated by sensor 1 is given by the following formula: V = N x (S1-S2) x (Tc-Tf) where N is the number of thermocouples, S1 and S2 are the Seebeck coefficient of the first and second thermoelectric materials, and (Tc-Tf) is the thermal gradient applied between the hot side and the cold side

Methodology Applied
Scientific EffectSeebeck effect: Seebeck Effect

Data Source

PatentEP3035017B1Differential temperature sensor
Publication Date: 2017.09.27 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • EP3035017B1 patent drawingFigure 1~2
  • EP3035017B1 patent drawingFigure 3~6
  • EP3035017B1 patent drawingFigure 7~8

AI summary

This sensor (1) comprises a set of thermoelectric layers, a support member (2) comprising at least a first and a second metallic connection pins (30, 31), first and second metallic connection means arranged to electrically connect the support member (2) with respectively a first connection pad and a second connection pad, an external housing (8) comprising a first face (8a) and a second opposite face (8b) intended to be connected respectively to a hot source and a cold source, a first via (80) connecting the first face (8a) to each first connection pin (30), a second via (81) connecting the second face (8b) to each second connection pin (31), and the support member (2) comprises means for heat transfer between the connection pins (30, 31) and the metallic connection means.