Differential Signal Ball Arrangement for High-Speed Semiconductor Packages
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Solution Overview
Problem
Current semiconductor devices face challenges in achieving high-speed operability due to limitations in signal transmission and reception, particularly with single solder ball sets for high-speed signals, which restrict data transmission capacity and reliability.
Innovation Solution
The semiconductor package incorporates a substrate with a sealing portion, a controller, semiconductor chips, and multiple differential signal balls, including PCIe signal balls, arranged substantially parallel to one side of the substrate, along with thermal and power supply balls, to enhance signal integrity and heat dissipation, thereby increasing data transmission capacity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple differential signal balls are arranged substantially parallel to one side of the substrate, then signal transmission capacity and reliability are improved, but device complexity increases
Solution Approach 1:
The substrate is divided into multiple sides, with differential signal balls arranged parallel to each side. This segmentation allows systematic organization of multiple signal balls without creating random complexity, enabling scalable expansion of signal transmission capacity while maintaining structured layout
Solution Approach 2:
Ground balls are positioned between adjacent differential signal balls to serve as intermediaries that reduce signal interference. This intermediary arrangement improves signal transmission reliability by isolating adjacent differential pairs, while the regular spacing pattern prevents excessive complexity
2Reliability
If ground balls are arranged between adjacent differential signal balls, then signal interference is reduced, but manufacturing complexity increases
Solution Approach 1:
Ground balls are strategically positioned only between adjacent differential signal balls where interference occurs, rather than uniformly across the entire substrate. This local quality approach targets signal interference reduction precisely where needed, while avoiding unnecessary manufacturing complexity in other regions
Solution Approach 2:
The arrangement follows a regular pattern where ground balls are placed at fixed intervals between differential signal balls. This parameter-based regularity (consistent spacing and positioning) simplifies manufacturing by providing clear placement rules, reducing the precision burden compared to arbitrary positioning
3Temperature
If thermal balls are arranged on the substrate, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
Thermal balls are merged with the ground balls in the same arrangement structure. By combining the thermal management function with the existing ground ball positions, the patent achieves heat dissipation without adding separate complex thermal management structures, thus improving temperature control while limiting complexity increase
Data Source
AI summary
A semiconductor device includes a substrate, a sealing portion, a controller, a semiconductor chip, and a plurality of differential signal balls. The substrate has a first surface and a second surface positioned on a side opposite to the first surface. The sealing portion is formed on the first surface of the substrate. The controller is covered with the sealing portion. The semiconductor chip is electrically connected to the controller, and is covered with the sealing portion. The plurality of differential signal balls are formed on the second surface of the substrate. At least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate.