Differential Signal Line Shielding in Display Panel Substrates
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Solution Overview
Problem
Current differential signal lines on display panel substrates are prone to external signal interference due to manufacturing limitations, leading to poor reliability in signal transmission.
Innovation Solution
A panel design featuring differential signal line groups and corresponding ground wire groups on the same substrate, where ground wires are strategically placed on either side of signal lines to reduce interference, with specific geometric relationships and layer configurations to optimize signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If differential signal lines are used for high-speed data transmission, then data transmission rate is improved, but signal reliability deteriorates due to external interference
Solution Approach 1:
Ground wires are introduced as intermediary elements between the differential signal lines and the external environment. These ground wires act as a mediator to intercept and divert external interference away from the signal lines, protecting the high-speed data transmission from noise and electromagnetic interference while maintaining the differential signaling structure
Solution Approach 2:
The patent converts the potentially harmful external electromagnetic interference into a beneficial shielding effect by strategically placing ground wires. The ground wires create a reference potential that attracts interference away from the signal lines, effectively using the interference pathway to reinforce signal integrity through the differential mode operation
2Reliability
If ground wires are added to shield signal lines, then signal reliability is improved, but device complexity increases
Solution Approach 1:
The ground wires are merged with the existing differential signal line structure to form integrated ground wire groups. Each ground wire group is directly associated with its corresponding differential signal line group, creating a unified shielding unit that reduces overall structure complexity compared to separate grounding systems
Solution Approach 2:
Ground wires are strategically placed only where needed - specifically on both sides of each differential signal line group - rather than providing uniform grounding across the entire substrate. This localized approach maintains reliability where interference is most problematic while minimizing unnecessary structural complexity in other areas
3Object-affected harmful factors
If ground wires are placed close to signal lines for shielding, then interference protection is improved, but manufacturing precision requirements increase
Solution Approach 1:
The grounding system is segmented into discrete ground wire groups, each independently associated with a specific differential signal line group. This segmentation allows for modular manufacturing and placement, where each ground wire group can be positioned and manufactured as a separate unit, reducing the cumulative precision requirements compared to a continuous grounding system
Solution Approach 2:
The ground wire groups are designed and positioned in advance during the layout phase, with predetermined locations on both sides of each differential signal line group. This preliminary positioning establishes fixed reference points that guide the manufacturing process, reducing the need for high-precision adaptive adjustments during fabrication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shields against external signal interference, improving the reliability and efficiency of signal transmission by maintaining characteristic impedance within target values.
Implementation Method 1
at least one ground wire group on the base substrate and on the same side of the base substrate as the at least one differential signal line group, wherein the at least one ground wire group is in one-to-one correspondence with the at least one differential signal line group
Data Source
AI summary
The present disclosure provides a panel, a manufacturing method for the same, and a terminal. The panel includes: a base substrate; at least one differential signal line group on the base substrate, each including two signal lines; and at least one ground wire group on the base substrate and on the same side of the base substrate as the at least one differential signal line group. The at least one ground wire group is in one-to-one correspondence with the at least one differential signal line group, each ground wire group includes two ground wires, and orthographic projections of the two ground wires in each ground wire group on the base substrate are on two sides of an orthographic projection of a corresponding differential signal line group on the base substrate, respectively.