Differential Speed Bonding for Disposable Undergarment Chip Removal
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Solution Overview
Problem
The existing methods for producing disposable undergarments, such as diapers, face challenges in efficiently removing unwanted web material portions like leg holes due to die wear, leading to incomplete cuts and increased die change-outs, which affect production efficiency and quality.
Innovation Solution
An apparatus utilizing rotationally variable speed shoes and transfer rolls to create bond zones and efficiently separate web material from chips by controlling rotational speeds to achieve effective ripping, allowing for continuous and discontinuous side-by-side bonding, thereby extending die life and improving production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If die cutting is used to remove chip portions from the web, then leg holes and void spaces are created in the undergarment, but die wear causes duller cuts and incomplete separation of chips from the web
Solution Approach 1:
The patent replaces the traditional mechanical die-cutting system with a tearing system that uses differential rotation between a shoe and transfer roll to create relative motion and separate chips from the web through controlled tearing rather than mechanical cutting, eliminating die wear issues
Solution Approach 2:
The patent introduces a shoe as an intermediary component between the web and the separation mechanism. The shoe receives chips from the die-anvil system and uses rotational speed differential to tear chips away from the web, serving as a mediator that eliminates the need for direct die contact
2Manufacturing precision
If die change-outs are performed frequently to maintain cut quality, then manufacturing precision is maintained, but production efficiency and productivity decrease
Solution Approach 1:
The patent replaces the mechanical die-cutting system with a tearing system that uses differential rotation between a shoe and transfer roll to create relative motion and separate chips from the web through controlled tearing rather than mechanical cutting, eliminating die wear issues
Solution Approach 2:
The patent uses a shoe and transfer roll system that can operate continuously without wear, replacing the need for frequent die changes. The system accepts minor imperfections in chip separation while maintaining overall product quality, effectively treating the separation mechanism as a disposable or low-maintenance component
3Stability of the object's composition
If multiple layers are adhesively joined to form the completed undergarment, then proper shape and layer retention are achieved, but complex bonding operations increase process time and reduce productivity
Solution Approach 1:
The patent combines multiple bonding operations into a single continuous bonding zone where all layers are adhesively joined simultaneously in one pass rather than through multiple sequential bonding steps, reducing process time while maintaining layer retention
Solution Approach 2:
The patent implements continuous bonding along the entire length of the undergarment as the web moves through the bonding zone, eliminating intermittent bonding operations and maintaining continuous production flow, thereby improving productivity while ensuring consistent layer retention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the efficiency of chip removal and bonding processes, reducing die change-outs and ensuring consistent quality by maintaining sharp cuts and effective separation of web material, thus prolonging die usage and improving manufacturing productivity.
Implementation Method 1
a rotationally variable speed shoe for receiving a chip, a rotationally constant speed transfer roll for receiving a portion of a web from a die and anvil system
Implementation Method 2
next slowing in rotational speed to allow said portion of said web to rip away from said chip at a leading rotational edge of said chip, next increasing in rotational speed to allow said chip to rip away from said web at a trailing rotational edge of said chip
Implementation Method 3
Each of these layers needs to be adhesively joined at some point in the manufacturing process to the elastic web laminate to form the completed undergarment
Data Source
Figure 1~2
Figure 3
Figure 4~6
AI summary
An apparatus having independently rotating shafts for producing discontinuous and continuous side by side bonding using independently rotating bonding units.