Differential Varactor Inner Spacing Reduction

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Solution Overview

Problem

Conventional differential varactors have limitations in reducing size, resistance, Q-factor, and tunability due to their design, which affects their performance in applications like electronic oscillators.

Innovation Solution

A high-Q differential varactor design with reduced inner spacing dimensions between differential fingers, eliminating stripes and contacts within this spacing, and using doped regions externally to minimize resistance and increase the Q-factor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional differential varactors include stripes and contacts in inner spacing between differential fingers, then resistance is reduced, but device size increases and Q-factor decreases

Engineering Contradiction:
ImproveQ-factorVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent removes stripes and contacts from the inner spacing between differential fingers, extracting these elements that were previously used for resistance reduction. This elimination of unnecessary components reduces device area and improves Q-factor by removing parasitic effects associated with these structures.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent moves doped regions from the inner spacing area to external areas around the differential fingers. This spatial redistribution in another dimension (from internal to external positioning) allows resistance reduction without occupying valuable inner spacing, thereby maintaining small device size while improving electrical performance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If conventional differential varactors include doped regions in inner spacing for common terminal contact, then contact area is provided, but inner spacing dimensions increase reducing Q-factor

Engineering Contradiction:
ImproveQ-factorVSAvoidinner spacing dimension
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The patent extracts doped regions from the inner spacing between differential fingers and relocates them to external areas. This removal from the critical inner spacing region reduces the spacing dimension, thereby increasing Q-factor while still providing adequate contact area for the common terminal through externally positioned doped regions.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The doped regions are repositioned from a two-dimensional inner spacing layout to an external three-dimensional arrangement around the differential fingers. This dimensional change allows the common terminal contact function to be maintained while minimizing the inner spacing footprint and maximizing Q-factor.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If inner spacing dimensions between differential fingers are reduced, then Q-factor increases, but resistance increases

Engineering Contradiction:
ImproveQ-factorVSAvoidresistance
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent compensates for increased resistance from reduced inner spacing by positioning doped regions in external areas rather than within the inner spacing. This spatial relocation in another dimension provides alternative low-resistance paths for current flow, reducing overall device resistance while maintaining the small inner spacing dimensions necessary for high Q-factor.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent modifies the doping parameters and positioning of semiconductor regions to optimize the balance between resistance and Q-factor. By changing the doping concentration and spatial distribution of charge carriers in externally positioned doped regions, the patent achieves low resistance without requiring large inner spacing dimensions, thereby maintaining high Q-factor.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design results in a smaller, lower resistance, and more tunable varactor with a higher Q-factor, enhancing its performance in electronic oscillators and other applications by increasing capacitance variability.

Implementation Method 1

conventional differential varactors include doped regions in the inner spacing between the differential fingers. The doped regions are used as a contact area for a common terminal

Methodology Applied
Scientific EffectDoping: Dopants

Implementation Method 2

A varactor is a semiconductor diode with properties of a variable capacitor. In particular, a capacitance of the varactor depends on a voltage applied to the varactor

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS8115281B2Differential varactor
Publication Date: 2012.02.14 ATMEL CORP
  • US8115281B2 patent drawing
  • US8115281B2 patent drawing
  • US8115281B2 patent drawing

AI summary

A high-Q differential varactor includes reduced inner spacing dimensions between differential fingers.