Differential Via Hole Layout for PCB Impedance Continuity
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Solution Overview
Problem
Multi-layer circuit boards experience poor impedance continuity due to deviations in differential via hole impedance at connections, leading to signal quality deterioration and potential system failure.
Innovation Solution
A via hole structure with pairs of differential signal holes having varying distances between their central axes and potentially different apertures, adjusted to manage parasitic capacitance and inductance, ensuring impedance continuity and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If differential via holes are used for high-speed signal interconnection, then signal transmission capability is improved, but impedance continuity deteriorates due to impedance deviation at connections
Solution Approach 1:
The patent applies parameter changes by varying the distance between the central axes of differential signal holes in different layers. Specifically, the horizontal distance between differential signal holes in the first layer is set differently from the horizontal distance between differential signal holes in the second layer, thereby adjusting parasitic capacitance and inductance to achieve impedance matching and improve impedance continuity while maintaining high-speed signal transmission capability
Solution Approach 2:
The patent applies local quality by making the structural parameters of differential signal holes location-specific. Different regions of the circuit board have different hole spacing configurations tailored to their specific impedance requirements, allowing each local area to optimize its impedance characteristics for reliable high-speed signal transmission
2Ease of manufacture
If fixed distance between differential signal hole central axes is used, then manufacturing simplicity is maintained, but impedance continuity cannot be optimized
Solution Approach 1:
The patent changes the geometric parameter of hole spacing to optimize impedance. By setting different horizontal distances between differential signal holes in different layers, the patent achieves precise impedance control and continuity optimization while maintaining compatibility with standard manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure improves impedance continuity and signal propagation quality by adjusting the impedance of differential signal holes, addressing impedance discontinuities and enhancing signal integrity.
Implementation Method 1
adjusted to manage parasitic capacitance and inductance, ensuring impedance continuity and signal integrity
Implementation Method 2
adjusted to manage parasitic capacitance and inductance, ensuring impedance continuity and signal integrity
Data Source
AI summary
Provided in the present disclosure are a via hole structure of a circuit board, and a circuit board. The via hole structure comprises at least one pair of differential signal holes, wherein each pair of differential signal holes comprises a first differential signal hole and a second differential signal hole. In a thickness direction of the circuit board, there are several distances between the central axis of the first differential signal hole and the central axis of the second differential signal hole, and numerical values of at least two distances are different.