Diffraction Structure for Object Measurement
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Solution Overview
Problem
Existing methods for analyzing substance characteristics using electromagnetic waves suffer from low sensitivity and reproducibility due to dispersion caused by the adhesion between the object and the support film, as well as the properties of the support film itself.
Innovation Solution
Directly attaching the object to be measured to a structure causing a diffraction phenomenon, preferably by chemical bonding, and using a conductor or host molecules bonded to the structure to enhance measurement sensitivity and reproducibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a support film is used to hold the object on the void-disposed structure, then the object can be stably supported, but the frequency characteristic changes due to adhesion and deflection, reducing measurement precision
Solution Approach 1:
The invention removes the support film from the measurement system entirely. By directly disposing the object on the void-disposed structure without any intermediate support film, the source of adhesion-induced frequency shifts and deflection is eliminated, thereby resolving the contradiction between support stability and measurement precision.
Solution Approach 2:
The invention merges the object directly with the void-disposed structure by disposing the object in direct contact with the structure. This eliminates the intermediate support film layer, allowing the object to be stably supported while avoiding the measurement errors caused by the film's adhesion and mechanical properties.
2Ease of operation
If a support film is used to hold the object, then the object can be positioned on the structure, but dispersion in the support film causes dispersion in measured values, reducing reproducibility
Solution Approach 1:
The support film is completely removed from the system. The object is disposed directly on the void-disposed structure, eliminating the source of dispersion (thickness dispersion, permittivity dispersion) that caused reproducibility issues in measurements.
3Productivity
If a void-disposed structure is used for measurement, then substance characteristics can be analyzed, but adhesion between the object and support film causes frequency characteristic changes, reducing sensitivity
Solution Approach 1:
The support film is removed to eliminate adhesion-induced frequency shifts. The object is disposed directly on the void-disposed structure, ensuring that frequency characteristic changes are caused solely by the object's presence and properties, thereby maximizing measurement sensitivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves measurement sensitivity and reduces dispersion, enabling high-reproducibility analysis by directly attaching the object to the structure, thereby minimizing the impact of support film properties and adhesion issues.
Implementation Method 1
irradiating the structure on which the object to be measured is disposed, causing a diffraction phenomenon with an electromagnetic wave and analyzing a scattering spectrum thereof
Data Source
AI summary
A method of attaching an object to be measured to a structure causing a diffraction phenomenon; irradiating the structure to which the object to be measured is attached and which causes the diffraction phenomenon with an electromagnetic wave; detecting the electromagnetic wave scattered by the structure causing the diffraction phenomenon; and measuring a characteristic of the object to be measured from the frequency characteristic of the detected electromagnetic wave. The object to be measured is attached directly to the surface of the structure causing the diffraction phenomenon. Thus, the method for measuring the characteristic of an object to be measured exhibits an improved measurement sensitivity and high reproducibility. A structure causing a diffraction phenomenon and used for the method, and a measuring device are provided.


