Diffusing Element for Uniform Curing in Semiconductor Planarization
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Solution Overview
Problem
Current fluid deposition techniques in semiconductor fabrication face challenges with non-uniform curing due to collimated light deflection by superstrate chucks, leading to irregular planarization and subsequent defects in semiconductor substrates.
Innovation Solution
A system incorporating a diffusing element with a patterned surface, positioned between the radiation source and superstrate chuck, diffuses collimated light to ensure uniform curing, aligning with the geometric features of the superstrate chuck to reduce Fresnel diffraction and re-direction effects, thereby enhancing planarization quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If collimated light is used for curing polymerizable material, then curing speed is improved, but non-uniform curing occurs due to light deflection by superstrate chuck
Solution Approach 1:
A diffusing element is introduced as an intermediary component between the radiation source and the polymerizable material. This diffusing element scatters the collimated light into diffused light, eliminating the deflection effects caused by the superstrate chuck while maintaining effective curing. The diffusing element acts as a mediator that transforms the light characteristics to achieve both uniformity and adequate curing speed.
Solution Approach 2:
The patent changes the optical parameter of the light beam by transitioning from collimated light to diffused light. This parameter change is achieved by positioning a diffusing element in the optical path, which modifies the light's propagation characteristics. The diffused light distributes more uniformly across the polymerizable material, eliminating the non-uniform curing caused by collimated light deflection.
2Manufacturing precision
If superstrate chuck with geometric features is used to hold superstrate, then superstrate positioning is improved, but Fresnel diffraction and light re-direction occur causing non-uniform curing
Solution Approach 1:
The patent converts the harmful effect of light deflection and Fresnel diffraction into a beneficial uniform distribution of light. By using a diffusing element, the previously harmful light re-direction caused by geometric features is transformed into a useful diffused light pattern that achieves uniform curing across the entire substrate area, including regions that would otherwise be affected by diffraction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves more uniform curing and improved planarization results, reducing non-uniformity in mechanical strength and etch performance, and enhances feature placement and depth of focus in lithographic processes.
Implementation Method 1
A diffusing element with a patterned surface, positioned between the radiation source and superstrate chuck, diffuses collimated light to ensure uniform curing
Implementation Method 2
aligning with the geometric features of the superstrate chuck to reduce Fresnel diffraction and re-direction effects
Implementation Method 3
providing a set of beams that pass through the diffusing element to cure the formable material over the substrate
Data Source
AI summary
A system and method of forming a planarization layer on a substrate is disclosed. The method can include holding a superstrate with a superstrate chuck, the superstrate chuck positioned relative to a diffusing element, where the diffusing element includes a pattern and the superstrate chuck includes one or more geometric features, and where the pattern of the diffusing element aligns with the one or more geometric features of the superstrate chuck. The method can also include dispensing a formable material over the substrate, contacting the formable material over the substrate with a superstrate, providing a set of beams that pass through the diffusing element to cure the formable material over the substrate and form a layer over the substrate while the superstrate is contacting the formable material.