Diffusion Bonded Fluid Delivery System for Semiconductor Processing
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Solution Overview
Problem
In semiconductor processing, existing fluid delivery systems face challenges in maintaining high leak integrity and corrosion resistance, particularly when handling toxic and corrosive gases like hydrogen and helium, due to the generation of particulates from rough surfaces and dead spaces in machined manifolds, which can lead to safety hazards and system downtime.
Innovation Solution
A diffusion bonding method is employed to fabricate fluid delivery systems using stainless steel sheets, involving pattern etching, electropolishing, grinding, and precise alignment, followed by uni-axial or HIP diffusion bonding at controlled temperatures and pressures to create a leak-tight, corrosion-resistant structure with reduced particulate generation and dead space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional machining methods are used to manufacture fluid delivery manifolds, then manufacturing simplicity is maintained, but particulate generation increases and surface smoothness deteriorates
Solution Approach 1:
The patent replaces traditional mechanical machining operations with diffusion bonding technology. Instead of machining manifolds from solid blocks (which generates particulates), the invention uses diffusion bonding to assemble pre-formed, smooth-surfaced components, thereby eliminating particulate generation during manufacturing while achieving the desired structural integrity and fluid flow characteristics.
Solution Approach 2:
The patent changes the manufacturing approach from subtractive machining to additive diffusion bonding. By controlling parameters such as bonding temperature, pressure, and time, the process achieves smooth surfaces and high precision without the particulate generation inherent in traditional machining methods.
2Reliability
If diffusion bonding is used to manufacture fluid delivery systems, then leak integrity and corrosion resistance are improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the fluid delivery system into multiple separable components that are manufactured independently and then joined through diffusion bonding. This segmentation allows each component to be optimized and manufactured separately using standard techniques, reducing overall manufacturing complexity while achieving high leak integrity through the diffusion-bonded joints.
Solution Approach 2:
The diffusion bonding process acts as an intermediary technique that joins components with molecular-level bonding. This intermediate process creates bonds that are as strong as or stronger than the base material, achieving high reliability without requiring complex welding or brazing operations.
3Reliability
If diffusion bonding is used to create leak-tight structures, then helium leak rate is reduced, but processing time and system downtime increase
Solution Approach 1:
The patent performs preliminary preparation of bonding surfaces including cleaning, polishing, and positioning before the diffusion bonding process. This preliminary action ensures that the actual bonding operation is quick and efficient, reducing overall processing time while achieving the required helium leak rate of 1×10^-9 cc/sec or better.
Solution Approach 2:
The patent optimizes diffusion bonding parameters such as temperature, pressure, and time to achieve the desired leak integrity in the shortest possible time. By carefully controlling these parameters, the process achieves helium leak rates of 1×10^-9 cc/sec while minimizing system downtime through efficient processing cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a fluid delivery system with enhanced mechanical strength, corrosion resistance, and high leak integrity, meeting stringent semiconductor industry standards, including a helium leak rate of 1×10−9 cc/sec, while minimizing particulate generation and system downtime.
Implementation Method 1
A diffusion bonding method is employed to fabricate fluid delivery systems using stainless steel sheets, involving pattern etching, electropolishing, grinding, and precise alignment, followed by uni-axial or HIP diffusion bonding at controlled temperatures and pressures to create a leak-tight, corrosion-resistant structure
Data Source
AI summary
The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.