Diffusion-Bonded Wiring Substrate for Low-Resistance Connections
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Solution Overview
Problem
Wiring substrates experience increased electrical resistance at the connection between via wiring and build-up wiring layers, leading to reduced reliability of electrical connections.
Innovation Solution
A wiring substrate design featuring diffusion-bonded metal plates with exposed mount regions for electronic components, where the metal plates are stacked and bonded to form a structure with reduced resistance connections, and an insulation layer covers the components and connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wiring layers and interlayer insulation layers are stacked with laser-cut openings, then electronic components can be mounted, but electrical resistance increases at the connection between via wiring and build-up wiring layers
Solution Approach 1:
The patent changes the material parameter from conventional insulation materials to metal plates with high electrical conductivity. This parameter change eliminates the electrical resistance issue at connections by replacing the insulating interlayer material with conductive metal plates that are diffusion-bonded to electrodes, ensuring low-resistance electrical pathways while maintaining structural integrity.
Solution Approach 2:
The patent employs composite material structure by stacking multiple metal plates with different properties. The first metal plate provides the electrode and mount portion, while the second metal plate with diffusion-bonded electrode provides both mechanical support and electrical conductivity. This composite structure resolves the contradiction by combining materials that offer both structural integrity and low electrical resistance.
2Manufacturing precision
If multiple metal plates are diffusion-bonded together, then electrical resistance is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the wiring substrate into multiple separate metal plates that can be manufactured independently and then diffusion-bonded together. This segmentation allows each plate to be optimized and manufactured separately using standard processes, reducing overall manufacturing complexity while achieving low-resistance connections through the diffusion bonding interface.
Solution Approach 2:
The patent replaces conventional mechanical assembly methods (such as soldering or bonding with adhesives) with diffusion bonding, a metallurgical joining process that creates atomic-level bonds between metal surfaces. This substitution eliminates the need for complex multi-step assembly processes while achieving superior electrical and mechanical connections.
3Adaptability or versatility
If the first metal plate includes a mount portion for electronic components, then component integration is improved, but the structure becomes more complex
Solution Approach 1:
The first metal plate serves multiple functions: it provides the electrode for electrical connection, contains the mount portion for electronic component attachment, and acts as a structural substrate. This multi-functionality integrates component mounting capabilities directly into the base metal plate without requiring additional separate structures, thereby reducing overall device complexity while improving adaptability.
Solution Approach 2:
The patent merges the electrode function and component mount function into a single integrated metal plate structure. The mount portion is formed as an integral part of the first metal plate rather than as a separate component, combining multiple functions into one element and simplifying the overall device structure while enhancing component integration capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability of electrical connections by reducing resistance and facilitating efficient heat dissipation, while simplifying manufacturing and assembly processes.
Implementation Method 1
The second metal plate includes a second electrode diffusion-bonded to an upper surface of the first electrode
Data Source
AI summary
An embodiment is a wiring substrate that includes a first metal plate. The first metal plate includes a first electrode and a wiring, and the wiring includes a mount portion for an electronic component. The wiring substrate further includes a second metal plate. The second metal plate includes a second electrode diffusion-bonded to an upper surface of the first electrode. The second metal plate includes a first opening that exposes the mount portion. The first opening is large enough to accommodate the electronic component.