Diffusion-Couple Graphene Synthesis for BEOL Thermal Budgets

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Solution Overview

Problem

Current methods for synthesizing high-quality graphene over large substrates at low temperatures and within a strict thermal budget are limited by the inability to achieve uniform temperature and pressure distribution, making it challenging to integrate graphene synthesis into mainstream electronics without damaging underlying devices.

Innovation Solution

A scalable diffusion-couple apparatus with a process chamber that allows for independent temperature control of both the bottom and top disks, enabling uniform mechanical pressure application and low-chamber pressure to facilitate the migration of carbon atoms across a diffusion couple on a substrate, specifically designed for wafer-scale graphene synthesis.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional single-temperature heating is used for graphene synthesis, then the device complexity is reduced, but the manufacturing precision of uniform temperature distribution deteriorates

Engineering Contradiction:
Improveuniformity of temperature distributionVSAvoidcomplexity of heating system
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The heating system is segmented into two independent heating zones: a bottom heater for substrate heating and a top heater for carbon source heating. Each heater can be independently controlled to achieve different temperature profiles, enabling uniform temperature distribution across the diffusion couple while maintaining manageable device complexity through modular design.

Inventive Principle:
Principle #1Segmentation

2Reliability

If high chamber pressure is applied during graphene synthesis, then the mechanical pressure application is simplified, but the quality of graphene growth deteriorates due to contamination

Engineering Contradiction:
Improvequality of graphene growthVSAvoiddifficulty of pressure control
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

A movable top disk acts as an intermediary mechanism that transmits mechanical force from an external pressure source to the carbon source. This intermediate component allows for precise control of applied pressure while maintaining a low chamber pressure environment, ensuring high-quality graphene growth without direct contamination from the pressure control system.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If long growth time is used for wafer-scale graphene synthesis, then the manufacturing precision of uniform graphene quality is improved, but the productivity deteriorates

Engineering Contradiction:
Improveuniformity of graphene qualityVSAvoidgrowth rate of graphene
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The process parameters are optimized by maintaining precise control over temperature (bottom heater at 1000-1500°C, top heater at 500-1000°C) and applied pressure (65-80 psi). These controlled parameter changes enable faster diffusion rates that reduce growth time while maintaining uniform graphene quality across the wafer surface, thus improving productivity without sacrificing precision.

Inventive Principle:
Principle #35Parameter changes

4Speed

If high temperature is used for graphene synthesis, then the speed of carbon diffusion is improved, but the harmful factors increase due to thermal damage to underlying devices

Engineering Contradiction:
Improvediffusion rate of carbon atomsVSAvoidthermal damage to devices
Core Design Contradiction:
SpeedVSObject-affected harmful factors

Solution Approach 1:

Different regions of the system are maintained at different temperatures: the bottom substrate heater operates at 1000-1500°C to enable rapid carbon diffusion, while the top heater operates at a lower temperature of 500-1000°C for carbon source preparation. This local quality differentiation allows high diffusion rates in the critical region while preventing thermal damage to underlying devices through controlled temperature gradients.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables high-quality graphene growth on large substrates (200/300mm) within the BEOL-compatible thermal budget, ensuring uniformity and scalability for various substrate geometries, thus integrating graphene synthesis into mainstream electronics without damaging underlying devices.

Implementation Method 1

A bottom heater can heat the substrate to a specified temperature

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

A top heater can heat the carbon source to a specified temperature

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 3

Solid-phase diffusion of atoms in a 'material stack' forming a 'diffusion-couple' can be leveraged to synthesize high-quality thin-films

Methodology Applied
Scientific EffectDiffusion: Diffusion

Implementation Method 4

Application of appropriate mechanical pressure (65-80 psi) on the carbon source

Methodology Applied
Scientific EffectCompression: Compression

Data Source

PatentEP4307354A1Low-temperature/BEOL-compatible highly scalable graphene synthesis tool
Publication Date: 2024.01.17 DESTINATION 2D INC
  • EP4307354A1 patent drawingFigure 1
  • EP4307354A1 patent drawingFigure 2
  • EP4307354A1 patent drawingFigure 3

AI summary

In one aspect, a highly scalable diffusion-couple apparatus includes a transfer chamber configured to load a wafer into a process chamber. The process chamber is configured to receive the wafer substrate from the transfer chamber. The process chamber comprises a chamber for growth of a diffusion material on the wafer. A heatable bottom disk includes a first heating mechanism. The heatable bottom disk is fixed and heatable to a specified temperature. The wafer is placed on the heatable bottom disk. A heatable top disk comprising a second heating mechanism. The heatable top disk is configured to move up and down parallel to the bottom disk to apply a mechanical pressure to the wafer on the heatable bottom disk. While the heatable top disk applies the mechanical pressure, a chamber pressure is maintained at a specified low value. The first heating mechanism and the second heating mechanism can be independently tuned to any value in the working range.