Diffusion-Layer Wiring Board for Adhesion Without Surface Roughness
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Solution Overview
Problem
Existing wiring boards face challenges in achieving strong adhesion between the substrate and the metal film, leading to potential peeling issues during etching and microfabrication, especially in high-frequency circuit applications where surface roughness and transmission loss are concerns.
Innovation Solution
A wiring board structure featuring a diffusion layer formed by interdiffusion of a first metal element oxide layer and a second metal element, which includes regions with both the first and second metal elements, providing strong adhesion and matching the etching rate of the metal film, thus preventing peeling and ensuring reliable microfabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a film containing a metal oxide is provided between an insulating substrate and a wiring to improve adhesion, then adhesion between substrate and wiring is improved, but surface roughness increases leading to transmission loss in high-frequency applications
Solution Approach 1:
The patent changes the chemical composition parameters of the diffusion layer by controlling the diffusion of metal elements (such as tungsten, molybdenum, or nickel) into the metal oxide film. This creates a gradient structure where the diffusion layer has intermediate properties: better adhesion than the original substrate while maintaining surface smoothness comparable to the metal film, thus resolving the contradiction between adhesion strength and surface roughness
Solution Approach 2:
The patent creates a composite diffusion layer structure consisting of multiple elements (metal oxide + diffused metal elements) that combines the advantages of both materials. The diffusion layer acts as an intermediate composite material with properties介于 the substrate and metal film, providing both strong adhesion and smooth surface for high-frequency applications
2Strength
If conventional adhesion layers are used between substrate and metal film, then adhesion is improved, but peeling occurs during etching and microfabrication processes
Solution Approach 1:
The patent modifies the etching rate parameter of the adhesion layer by controlling the diffusion of metal elements into the metal oxide film. The diffusion layer is engineered to have an etching rate that matches the metal film, preventing the peeling that occurs when there is a significant etching rate mismatch between layers during etching and microfabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The diffusion layer ensures firm adhesion between the substrate and the metal film, preventing peeling and enabling the production of reliable wiring boards with reduced surface roughness and transmission loss, suitable for high-frequency applications.
Implementation Method 1
converting the first intermediate layer to a second intermediate layer by diffusing the first element into the first intermediate layer
Implementation Method 2
converting the second intermediate layer to a diffusion layer by diffusing the second metal element into the second intermediate layer
Data Source
AI summary
A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.