Diffusion Nozzle Gas Flow for Substrate Temperature Uniformity

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Solution Overview

Problem

Existing liquid processing technologies face challenges in achieving uniform temperature distribution and preventing rippling or collapse of processing liquids on substrates during the development of resist films, leading to non-uniform resist patterns.

Innovation Solution

A liquid processing apparatus with a diffusion nozzle having multiple discharge openings at different angles is used to jet a cooling gas over a wide area of the substrate, including its central portion, while supplying processing liquids, which accelerates vaporization and minimizes the impact on the liquids, thereby maintaining uniform temperature and preventing rippling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If air is jetted onto the substrate to control temperature, then temperature distribution is improved, but rippling or collapse of processing liquid occurs

Engineering Contradiction:

Improvetemperature distributionVSAvoidstability of processing liquid

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The gas supply device is divided into multiple nozzles with different orientations (first nozzles facing upward, second nozzles facing sideways). This segmentation allows the gas flow to be distributed in different directions, reducing the impact force on the processing liquid while maintaining temperature control effectiveness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate receive gas flow from nozzles with different orientations. The first nozzles provide upward gas flow for overall temperature control, while the second nozzles provide sideways gas flow for localized cooling without directly impacting the processing liquid. This local differentiation resolves the contradiction between temperature control and liquid stability.

Inventive Principle:

Principle #3Local quality

2Temperature

If gas flow rate is increased to improve vaporization and temperature control, then temperature uniformity is improved, but impact on processing liquid increases causing rippling

Engineering Contradiction:

Improvetemperature uniformityVSAvoidimpact on processing liquid

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The gas supply system is segmented into first nozzles for overall temperature control and second nozzles for localized cooling. This allows the total gas flow rate to be distributed such that vaporization is enhanced without concentrating high-velocity impact on the processing liquid, thereby maintaining temperature uniformity while reducing harmful impact.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second nozzles act as intermediaries that provide sideways gas flow to accelerate vaporization at the liquid-gas interface without directly impacting the bulk processing liquid. This intermediary approach enables improved temperature control while protecting the processing liquid from direct high-velocity impact that would cause rippling.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures a more uniform temperature distribution across the substrate surface, reduces the risk of rippling or collapse of processing liquids, and allows for smooth execution of liquid processing operations.

Implementation Method 1

jet the gas from the diffusion nozzle onto a region of the front surface of the substrate including at least a central portion thereof in a state that the processing liquid is supplied on the front surface of the substrate

Methodology Applied

Scientific EffectVaporization: Evaporation

Implementation Method 2

accelerates vaporization and minimizes the impact on the liquids, thereby maintaining uniform temperature

Methodology Applied

Scientific EffectHeat transfer: Convection

Data Source

PatentUS11693322B2Liquid processing apparatus, liquid processing method, and computer-readable recording medium

Publication Date: 2023.07.04 TOKYO ELECTRON LTD

AI summary

A liquid processing apparatus includes a substrate holder configured to hold a substrate; a processing liquid supply configured to supply a processing liquid onto a front surface of the substrate; a gas supply configured to supply a gas onto the front surface of the substrate; and a controller. The gas supply includes a diffusion nozzle which is provided with multiple discharge openings respectively elongated at different angles with respect to the front surface of the substrate. The controller performs controlling the gas supply to jet the gas from the diffusion nozzle onto a region of the front surface of the substrate including at least a central portion thereof in a state that the processing liquid is supplied on the front surface of the substrate.