Diffusion Plate Hole Layout for Uniform Wafer Release Film Etching
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Solution Overview
Problem
As semiconductor devices continue to shrink in size, achieving uniformity in etch processes across the wafer surface becomes increasingly challenging due to the varying topography and complexity of features, leading to inefficiencies and reduced yield in semiconductor package formation.
Innovation Solution
A treatment system with a showerhead having a diffusion plate with varying hole densities and blocking dividers is used to ensure uniform distribution of treatment plasma across the wafer, facilitating uniform etching of release films and improving the efficiency and yield of semiconductor package formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etch processes are used on wafers with varying topography, then processing can be performed, but uniformity of etching across the wafer surface deteriorates
Solution Approach 1:
The diffusion plate incorporates concentric rings with varying hole densities, where inner rings have lower hole densities and outer rings have higher hole densities. This local variation in hole distribution compensates for the non-uniform plasma flow patterns caused by wafer topography, ensuring uniform etching across the entire wafer surface despite varying device complexity and topography
2Productivity
If feature size is reduced to improve integration density, then more components can be integrated, but etch uniformity deteriorates due to varying topography
Solution Approach 1:
The diffusion plate uses concentric rings with progressively varying hole densities to address local topography variations caused by high-density component integration. The varying hole distribution locally compensates for topography effects, maintaining etch uniformity even as integration density increases and feature sizes decrease
Solution Approach 2:
The invention transitions from a simple uniform hole pattern to a multi-dimensional concentric ring structure with varying hole densities. This dimensional complexity in the diffusion plate design enables compensation for topography variations, allowing high integration density to be achieved while maintaining etch uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves uniform etching of release films across the wafer, enhancing the efficiency and yield of semiconductor package formation by ensuring consistent precursor material distribution and etch rates across the wafer surface.
Implementation Method 1
flowing an etchant through a diffusion plate within a treatment chamber, the diffusion plate comprising concentric rings separated by dividers, the concentric rings comprising a first concentric ring of holes, a second concentric ring of holes, and a third concentric ring of holes
Implementation Method 2
performing a treatment process to remove the release film from the semiconductor wafer, the treatment process comprising: flowing an etchant through a diffusion plate
Data Source
AI summary
A method includes attaching a carrier to a semiconductor wafer using a release film; removing the carrier from the semiconductor wafer; and performing a treatment process to remove the release film from the semiconductor wafer, the treatment process comprising: flowing an etchant through a diffusion plate within a treatment chamber, the diffusion plate comprising concentric rings separated by dividers, the concentric rings comprising a first concentric ring of holes, a second concentric ring of holes, and a third concentric ring of holes, each of the concentric rings having a different hole density; and performing a cleaning process on the semiconductor wafer.