Diffusion Solder Contact Connection Without Oxide Layer Formation
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Solution Overview
Problem
The existing methods for making diffusion solder connections between electrically conductive contact elements and workpieces, such as aluminum sheets, are hindered by the formation of oxide layers that impede electrical connections, requiring heating and soldering processes which can be inefficient and prone to failure.
Innovation Solution
A protective chamber with an acceleration device is used to shoot a copper contact element into a workpiece, generating a vacuum or inert gas environment to prevent oxide layer formation, and utilizing a projectile with a cutting portion to remove oxide layers and form a diffusion solder connection without the need for additional heating or soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional soldering or welding methods are used to connect contact elements to workpieces, then mechanical and electrical connections can be established, but oxide layers form on the workpiece surfaces which impede electrical connection and reduce reliability
Solution Approach 1:
The patent applies an inert atmosphere principle by using a protective gas environment (such as nitrogen or argon) during the diffusion bonding process. This inert atmosphere prevents oxygen from contacting the aluminum workpiece surface, thereby preventing oxide layer formation that would otherwise impede electrical connection. The protective chamber filled with inert gas creates a controlled environment where the bonding occurs without oxidation, directly resolving the contradiction between establishing reliable electrical connections and preventing harmful oxide layer formation.
2Strength
If heating and soldering processes are used to create connections, then mechanical strength is achieved, but the process becomes complex and requires multiple steps including opening generation, contact element insertion, and soldering
Solution Approach 1:
The patent merges multiple separate process steps (opening generation, contact element insertion, and soldering/heating) into a single diffusion bonding operation. By using high pressure and temperature simultaneously applied during the acceleration and impact process, the connection is formed in one step rather than through sequential operations. This combining of functions reduces device complexity while maintaining mechanical strength, as the diffusion bonding process achieves both mechanical attachment and electrical connection simultaneously without requiring separate soldering equipment or multiple tooling steps.
Solution Approach 2:
The patent replaces traditional thermal soldering processes with a mechanical impact-based diffusion bonding process. Instead of using prolonged heating and soldering operations, the contact element is accelerated and impacted into the workpiece, creating immediate high pressure and temperature conditions that facilitate atomic diffusion and bonding. This substitution eliminates the need for separate heating apparatus, solder materials, and multi-step thermal processes, thereby reducing device complexity while achieving equivalent or superior mechanical strength through the mechanical impact mechanism.
3Manufacturing precision
If contact elements are inserted into workpieces through pre-generated openings, then connection positioning is achieved, but oxide layers form on the inner walls of openings before insertion which prevent proper electrical connection
Solution Approach 1:
The patent applies preliminary action by performing the bonding operation immediately upon contact element impact, before oxide layers can form on the freshly created or pre-generated opening surfaces. The acceleration and impact process occurs so rapidly that the contact element penetrates and bonds with the workpiece material before oxidation can occur on the exposed surfaces. This timing-based preliminary action ensures that the bonding interface remains oxide-free, maintaining both positioning precision and electrical conductivity without requiring separate oxidation prevention steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures reliable mechanical and electrical conductivity between the contact element and the workpiece by preventing oxide layer formation and eliminating the need for subsequent heating or soldering, thereby enhancing connection quality and efficiency.
Implementation Method 1
The acceleration device accelerates a contact element and shoots the contact element into a workpiece (9) arranged at a workpiece position (7)
Implementation Method 2
generating a vacuum or inert gas environment to prevent oxide layer formation
Implementation Method 3
utilizing a projectile with a cutting portion to remove oxide layers and form a diffusion solder connection without the need for additional heating or soldering
Data Source
AI summary
An arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece includes a protective chamber and an acceleration device. The protective chamber has a workpiece position at which at least a portion of the workpiece is arranged. The acceleration device shoots the electrically conductive contact element into the workpiece arranged at the workpiece position.