Digital Isolator Insulating Layer for Leakage and Peeling Control
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Solution Overview
Problem
Current digital isolators face challenges in enhancing reliability due to issues with leakage current and stress-induced peeling of insulating layers, particularly when subjected to high voltage and thermal expansion.
Innovation Solution
The digital isolator design incorporates a first and second layer with higher carbon concentrations, which are insulative and have lower Young's modulus, positioned around the bottom portions of the metal components, along with conductive layers made of tantalum, to suppress metal diffusion and stress dispersion, thereby reducing leakage current and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional insulating layers are used in digital isolators, then current blocking is achieved, but leakage current increases and insulating layers peel under stress
Solution Approach 1:
The patent changes the material parameters of the insulating layer by incorporating carbon at controlled concentrations (0.1-5 atom%) to modify electrical properties. This reduces leakage current while maintaining mechanical flexibility to prevent peeling under thermal and stress conditions.
Solution Approach 2:
The patent creates a composite insulating layer combining silicon oxide base material with carbon elements. This composite structure provides both electrical insulation properties and stress resistance, preventing peeling while reducing leakage current through the carbon-modified matrix.
2Volume of moving object
If metal portions are placed close together for compact design, then device size is reduced, but metal diffusion increases
Solution Approach 1:
The patent introduces a conductive layer comprising tantalum as an intermediary barrier between metal portions. This layer prevents direct contact and diffusion between metals while allowing compact positioning, thus maintaining small device size without compromising compositional stability.
Solution Approach 2:
The conductive tantalum layer provides continuous protection against metal diffusion throughout the device operation. This continuous barrier ensures long-term compositional stability even when metal portions are positioned closely for compact design.
3Object-generated harmful factors
If insulating layers are made thicker to reduce leakage current, then leakage current decreases, but stress-induced peeling increases
Solution Approach 1:
The patent modifies the insulating layer composition by adding carbon (0.1-5 atom%), which reduces electrical resistivity and leakage current. Simultaneously, this compositional change enhances mechanical flexibility and adhesion, preventing stress-induced peeling even at optimized thicknesses.
Solution Approach 2:
The patent applies carbon doping locally within the insulating layer to create regions with optimized electrical and mechanical properties. This local modification reduces leakage current in critical areas while maintaining overall layer integrity and adhesion under stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces leakage current and heat generation, while preventing peeling of insulating layers, thereby increasing the overall reliability and operational stability of the digital isolator.
Implementation Method 1
the first layer suppresses diffusion of metal atoms included in the first portion into the first insulating portion
Implementation Method 2
A digital isolator transmits a signal by utilizing the change of a magnetic field or an electric field in a state in which the current is blocked
Data Source
AI summary
According to one embodiment, a digital isolator includes a first metal portion, a first insulating portion, a second metal portion, a third metal portion, and a first layer. The first insulating portion is provided on the first metal portion. The second metal portion is provided on the first insulating portion. The third metal portion includes first, second, and third portions. The first portion is provided around the first metal portion in a direction perpendicular to a first direction. The second portion is provided on a portion of the first portion with a first conductive layer interposed. The third portion is provided on the second portion and provided around the second metal portion in the perpendicular direction. The first layer contacts the first conductive layer and an other portion of the first portion and is provided around a bottom portion of the second portion.