Digital Lithography Mura Reduction Through Seamless Substrate Stitching
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Solution Overview
Problem
Stitching on large area substrates in digital lithography leads to mura, which is a non-uniformity in the image quality, and there is a need for a system and method to address this issue.
Innovation Solution
A system and method that utilizes a processing unit to apply a virtual mask file with specific exposure patterns, including eye-to-eye and bridge-to-bridge boundaries, to pattern substrates using image projection systems, ensuring seamless transitions and reducing mura.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If stitching is used on large area substrates, then the substrate can be processed, but mura (non-uniformity in image quality) occurs
Solution Approach 1:
The substrate is divided into multiple sections (first, second, third, and fourth sections) that are processed by different image projection systems. Each section is exposed independently through coordinated stitching, allowing large area processing while maintaining uniformity through precise control of exposure parameters at section boundaries.
Solution Approach 2:
The patent applies different exposure patterns to different sections of the substrate. Specifically, first and second exposure patterns are applied to first and second sections respectively, with careful coordination at the boundaries (eye-to-eye and bridge-to-bridge boundaries) to ensure uniform image quality across the entire substrate without mura effects.
2Productivity
If multiple image projection systems are used to process large substrates, then processing capability is improved, but boundary uniformity deteriorates
Solution Approach 1:
The patent pre-defines specific exposure patterns for each section before actual processing. The first exposure pattern is prepared for the first section and the second exposure pattern for the second section, with boundary conditions预先 designed to ensure uniformity at eye-to-eye and bridge-to-bridge boundaries when sections are stitched together.
Solution Approach 2:
The patent controls exposure parameters (such as exposure dose, pattern design) differently for different sections to compensate for boundary effects. By adjusting these parameters locally at section boundaries, uniform image quality is maintained across the entire substrate even when multiple image projection systems are used.
Data Source
AI summary
A system, methods, and a non-transitory computer-readable medium for digital lithography to reduce mura in substrate sections. The boundary lines of the digital lithography need to be invisible. In one example, a system includes a processing unit configured to print a virtual mask file provided by a controller. The controller is configured to receive data and convert the data into a virtual mask file having an exposure pattern for a lithographic process. The exposure pattern includes a plurality of first sections, and second sections. Each first section forms a boundary with each second section along a first column of image projection systems of the processing unit. The controller patterns the substrate. The exposure pattern includes a first section pattern of each first section that crosses the eye to eye boundary with the second section making the boundary invisible.