Digital Plane Interface for Communication Node Circuit Boards
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Solution Overview
Problem
Current communication node architectures are costly due to the need for multiple layers of circuit boards to support both digital and analog signal transmission, leading to increased costs and inefficiencies.
Innovation Solution
A bifurcated circuit board design where a first circuit board supports digital signals and a second circuit board supports both digital and analog signals, connected via connectors, allowing for a digital plane interface and enabling the use of higher performing materials for analog circuits without increasing the number of layers, thus reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single circuit board supports both digital and analog signals, then integration is improved, but the number of layers increases and cost increases
Solution Approach 1:
The patent divides the circuit board into two separate boards: a first circuit board for digital signals and a second circuit board for analog signals. This segmentation allows each board to be optimized independently, reducing the overall layer count while maintaining functionality.
Solution Approach 2:
The patent extracts the analog signal processing function from the digital circuit board, creating a separate second circuit board dedicated to analog signals. This extraction reduces the complexity and layer count of the digital board while allowing specialized analog board design.
2Reliability
If higher performing materials are used for analog circuits, then signal integrity is improved, but cost increases
Solution Approach 1:
The patent applies different material qualities to different parts of the system: high-performance materials are used specifically on the second circuit board for analog signals where signal integrity is critical, while standard materials suffice for the first circuit board handling digital signals. This localized quality approach optimizes performance where needed while controlling costs.
3Adaptability or versatility
If more layers are added to support digital channels, then communication capability is improved, but cost increases
Solution Approach 1:
By segmenting digital and analog functions onto separate circuit boards, the patent allows the digital board to be optimized for channel capacity with appropriate layer count, while the analog board uses fewer layers optimized for signal integrity. This segmentation avoids the need for excessive layers that would be required if both functions were combined on a single board.
Data Source
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AI summary
A solution is provided that can be used in a communication node. A case is provided that supports a first circuit board that is connected to a second circuit board via a connection. The first circuit board supports an integrated circuit module and the second circuit board supports a PHY module. A transformer box is mounted on the first circuit board and supports terminals for engagement with a mating connector. A third circuit board can be provided that is parallel to the second circuit board and is mounted on the transformer box so that termination of signals provided to the terminals can take place on a different circuit board than the second circuit board. The third circuit board can also provide power over Ethernet (POE) circuitry.