Digital Varnish Application System for Packaging Substrates

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Solution Overview

Problem

Current analog printing techniques for packaging materials are inefficient for short production runs due to the costly and time-consuming process of generating custom varnish applicator plates, and varnishes can adversely affect adhesives and inkjet inks, making it difficult to achieve high-quality prints with varnish-free zones.

Innovation Solution

A varnish application system comprising two modular varnish application modules, where the first module applies varnish quickly to discrete portions and the second module fills in remaining areas, allowing for efficient and accurate application of varnish patterns, including varnish-free zones, using individually controllable varnish applicators and a controller to manage the process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If custom varnish applicator plates are generated using analog printing techniques, then varnish can be applied to packaging material, but the process becomes costly and time-consuming for short production runs

Engineering Contradiction:
Improvevarnish application processVSAvoidproduction time
Core Design Contradiction:
Ease of manufactureVSLoss of time

Solution Approach 1:

The patent uses digital printing technology to create varnish applications without requiring physical analog printing plates. The digital system stores varnish application patterns as data that can be rapidly reproduced and modified, eliminating the time-consuming plate generation process while maintaining manufacturing capability

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent replaces the mechanical analog printing plate system with a digital printing system. Instead of physically creating and mounting custom plates for each varnish application, the system uses digital files to control varnish applicators, dramatically reducing preparation time and costs for short production runs

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If varnish is applied to printed content, then resistance of printed content is enhanced, but adhesives and inkjet inks are adversely affected

Engineering Contradiction:
Improveprinted content resistanceVSAvoidimpact on adhesives and inkjet inks
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies varnish selectively to specific regions of the packaging material using digitally controlled varnish applicators. By controlling which areas receive varnish based on digital patterns, the system enhances printed content resistance only where needed while leaving other areas free for adhesive or inkjet ink application, thus avoiding adverse effects on these materials

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent divides the packaging material into distinct zones with different varnish application requirements. Some areas receive varnish for protection, while other areas are kept varnish-free for subsequent adhesive or inkjet processes, allowing each region to have the appropriate treatment for its specific function

Inventive Principle:
Principle #1Segmentation

3Manufacturing precision

If high-quality varnish patterns with varnish-free zones are achieved, then printing quality is improved, but production complexity increases

Engineering Contradiction:
Improvevarnish pattern precisionVSAvoidsystem complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent employs a single digital printing system that can handle multiple functions: printing graphics, defining varnish application patterns, and controlling varnish-free zones. This universal digital approach eliminates the need for separate analog printing plates and varnish applicator plates, reducing overall system complexity while maintaining high manufacturing precision through software control

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10335826B2Applying fluid to a substrate
Publication Date: 2019.07.02 HP SCITEX LTD
  • US10335826B2 patent drawing
  • US10335826B2 patent drawing
  • US10335826B2 patent drawing

AI summary

According to one example, a method may include determining a desired pattern of fluid to be applied to a substrate, controlling a first array of fluid applicators to apply fluid to the substrate to form a first portion of the pattern, in which an applicator of the first array of fluid applicators spans a section of the substrate that includes portions of the substrate both in and out of the pattern. The method may also include controlling the first array of fluid applicators to cause the applicator to not apply fluid to the section of the substrate and controlling a second fluid applicator to apply fluid to the section of the substrate, the second fluid applicator being separately movable from the first array of fluid applicators.