Multifunctional Digitizer Module Board Shield Film Integration

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Solution Overview

Problem

Conventional display systems with touch sensing devices have higher cost, thickness, and weight due to separate components like a reflector, digitizer sensor board, shield film, and back frame, which are not efficiently integrated.

Innovation Solution

A multifunctional digitizer module board is developed that integrates a shield film on a flexible digitizer sensor board without adhesive material, reducing thickness and weight by laminating the shield film with the sensor board using semiconductor processes, and coupling it with an LCD panel via a single interface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If separate components (reflector, digitizer sensor board, shield film, back frame) are used in conventional display systems, then each component can be optimized independently, but the overall system thickness and weight increase

Engineering Contradiction:

ImproveIndependent component optimizationVSAvoidSystem weight

Core Design Contradiction:

Ease of manufactureVSWeight of stationary object

Solution Approach 1:

The patent combines the shield film and digitizer sensor board into a single integrated module board. The shield film is formed directly on the digitizer sensor board substrate, eliminating the need for separate components and adhesive materials. This merging reduces the overall system weight while maintaining the independent optimization benefits through modular design of the integrated unit.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated module board serves multiple functions simultaneously: it acts as both the digitizer sensor board for touch sensing and the shield film for electromagnetic interference protection. This multi-functionality eliminates the need for separate dedicated shield film component, reducing system weight while maintaining both shielding and sensing capabilities.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Ease of manufacture

If separate components with adhesive materials are used, then assembly is straightforward, but the system thickness increases

Engineering Contradiction:

ImproveAssembly simplicityVSAvoidSystem thickness

Core Design Contradiction:

Ease of manufactureVSLength of stationary object

Solution Approach 1:

The shield film and digitizer sensor board are merged into a single integrated structure where the shield film is formed directly on the sensor board substrate. This eliminates the need for adhesive materials and separate assembly steps, reducing system thickness while maintaining assembly simplicity through the integrated manufacturing process.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The digitizer sensor board substrate serves as an intermediary that integrates both the sensing circuitry and the shield film function. This eliminates the need for separate adhesive materials to bond separate shield film and sensor board components, thereby reducing overall system thickness.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If multiple separate components are used, then functional requirements are met, but manufacturing cost increases

Engineering Contradiction:

ImproveFunctional requirement fulfillmentVSAvoidManufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

By merging the shield film and digitizer sensor board into a single integrated module board, the patent reduces the number of separate components that need to be manufactured, stored, and assembled. This integration reduces manufacturing costs while maintaining all necessary functions through the combined structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated module board provides multiple functions (touch sensing, electromagnetic shielding) in a single component, reducing the total component count and associated manufacturing costs. The multi-functional design eliminates the need for separate dedicated components for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Strength

If adhesive materials are used to laminate shield film, then bonding is achieved, but weight and thickness increase

Engineering Contradiction:

ImproveBonding strengthVSAvoidSystem weight

Core Design Contradiction:

StrengthVSWeight of stationary object

Solution Approach 1:

The digitizer sensor board substrate acts as an intermediary that directly supports both the sensing circuitry and the shield film. This eliminates the need for adhesive materials to bond separate components, reducing system weight while maintaining strong bonding through the integrated structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The shield film and digitizer sensor board are merged into a single integrated component where the shield film is formed directly on the substrate. This eliminates adhesive materials entirely, reducing system weight while maintaining bonding strength through the integrated manufacturing process.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS7649525B2Display systems with multifunctional digitizer module board

Publication Date: 2010.01.19 RED OAK INNOVATIONS LTD

AI summary

Display systems with multifunctional digitizer module board. A shield film is integrated on a digitizer sensor board to form a multifunctional digitizer module board with lower thickness and weight. In the multifunctional digitizer module, a digitizer sensor board senses position of a position pointer or finger contact on a surface and a shield film is integrated on one surface of the digitizer sensor board by semiconductor process to screen out external noise. A display panel is disposed above the multifunctional digitizer module board and coupled thereto, displaying images.