Digitizer Photosensitive Resin Layers for Foldable Display Visibility
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Solution Overview
Problem
Existing electronic apparatuses face challenges in achieving improved visibility and folding properties while maintaining reliability, particularly in the design and manufacturing process.
Innovation Solution
An electronic apparatus is designed with a window, a display panel, and a digitizer that includes multiple photosensitive resin layers and adhesive layers, along with sensing coils and shielding layers, to enhance visibility and folding capabilities. The digitizer is manufactured using a process that involves forming sensing coils on photosensitive polyimide resin layers and adhering them with adhesive layers, which provides the necessary rigidity and surface smoothness for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If traditional materials and structures are used in the digitizer, then manufacturing simplicity is maintained, but visibility and folding properties are compromised
Solution Approach 1:
The patent employs composite materials consisting of multiple photosensitive resin layers with different storage moduli values. The first photosensitive resin layer has a storage modulus of 0.5-2 GPa for flexibility and folding, while the second photosensitive resin layer has a storage modulus of 2-5 GPa for structural support and visibility. This composite structure resolves the contradiction by combining materials with complementary properties to achieve both improved visibility and folding characteristics without excessive complexity.
Solution Approach 2:
The patent applies local quality by assigning different storage modulus values to different regions of the digitizer. The first photosensitive resin layer with lower storage modulus (0.5-2 GPa) is positioned where flexibility and folding are needed, while the second photosensitive resin layer with higher storage modulus (2-5 GPa) is positioned where structural integrity and visibility are critical. This localized differentiation allows the digitizer to exhibit both improved visibility and folding properties simultaneously.
2Adaptability or versatility
If the digitizer structure is made more complex to improve folding properties, then folding capabilities are enhanced, but manufacturing process becomes more difficult
Solution Approach 1:
The patent segments the digitizer into multiple photosensitive resin layers, each with specific storage modulus values and functions. The first photosensitive resin layer (0.5-2 GPa) provides flexibility for folding, while the second photosensitive resin layer (2-5 GPa) provides structural support. This segmentation allows each layer to be optimized independently for its specific function, improving folding properties while maintaining manufacturing simplicity through modular construction.
Solution Approach 2:
The patent utilizes parameter changes by varying the storage modulus values of the photosensitive resin layers. The first layer has a storage modulus of 0.5-2 GPa optimized for flexibility and folding, while the second layer has a storage modulus of 2-5 GPa optimized for structural integrity. This parameter differentiation enables the digitizer to achieve improved folding properties without complicating the manufacturing process, as the layers can be manufactured using standard photopolymerization techniques with controlled material properties.
3Manufacturing precision
If photosensitive resin layers with specific storage modulus are used, then rigidity and surface smoothness are improved, but material selection becomes more constrained
Solution Approach 1:
The patent employs composite materials with specifically controlled storage modulus values to achieve both rigidity and surface smoothness. The first photosensitive resin layer (0.5-2 GPa) provides flexibility and smooth surface characteristics, while the second photosensitive resin layer (2-5 GPa) provides structural rigidity. This composite approach resolves the contradiction by combining materials with complementary mechanical properties, maintaining manufacturing precision while expanding material selection through the use of specialized photosensitive resins with controlled storage moduli.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in an electronic apparatus with enhanced visibility, improved folding properties, and increased reliability, while simplifying the manufacturing process and reducing costs by using photosensitive polyimide resin layers with a storage modulus of 0.5 GPa to 2 GPa, ensuring suitable rigidity and surface smoothness for foldable devices.
Implementation Method 1
a first adhesive layer disposed between the first photosensitive resin layer and the second photosensitive resin layer and which adheres the first photosensitive resin layer and the second photosensitive resin layer
Implementation Method 2
Each of the first photosensitive resin layer and the second photosensitive resin layer may have a storage modulus of approximately about 0.5 Gigapascals (GPa) to about 2 GPa
Implementation Method 3
the digitizer may further include a shielding layer disposed on a lower surface of the second photosensitive resin layer. In an embodiment, the shielding layer may contain magnetic metal powder ('MMP')
Data Source
AI summary
An electronic apparatus includes a window, a display panel disposed on a lower surface of the window, and a digitizer disposed on a lower surface of the display panel. The digitizer includes a first photosensitive resin layer, a first sensing coil disposed on one surface of the first photosensitive resin layer, a second photosensitive resin layer disposed spaced apart from the first photosensitive resin layer, and a first adhesive layer disposed between the first photosensitive resin layer and the second photosensitive resin layer and which adheres the first photosensitive resin layer and the second photosensitive resin layer.