Dimer Acid Polyamide Hot Melt Adhesion
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Solution Overview
Problem
Existing hot melt compositions for electronic components face issues with high water absorption, poor adhesion to substrates with low polarity, and inadequate thermal stability, leading to instability and performance deterioration under high temperatures.
Innovation Solution
A hot melt composition comprising a dimer acid-based polyamide blended with an olefin-based-modified polymer, where the olefin-based-modified polymer is produced by polymerizing olefin, (meth)acrylic acid ester, and acid anhydride, and grafted with a polyamide, maintaining a specific weight ratio to enhance adhesion and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a dimer acid-based polyamide is used to improve adhesion to substrates, then adhesion force is improved, but water absorption increases
Solution Approach 1:
The patent uses a composite material system consisting of dimer acid-based polyamide (providing adhesion) combined with carboxyl group-containing olefin (providing water resistance). This composite approach allows the material to simultaneously achieve good adhesion to substrates while maintaining low water absorption, resolving the contradiction between these two properties.
2Quantity of substance
If carboxyl group-containing olefin is added to improve water resistance, then water absorption is reduced, but adhesion to low polarity substrates deteriorates
Solution Approach 1:
The patent applies local quality by having different components perform different functions: the dimer acid-based polyamide provides adhesion to substrates while the carboxyl group-containing olefin provides water resistance. Each component is optimized for its specific function, and their combination creates a material with both properties.
3Quantity of substance
If existing polymer compositions are used to improve water resistance, then water absorption is reduced, but thermal stability and viscosity stability deteriorate
Solution Approach 1:
The patent achieves improved water resistance while maintaining thermal and viscosity stability by carefully controlling the composition parameters: using 2-20 mass% carboxyl group-containing olefin and 80-78 mass% dimer acid-based polyamide. This parameter optimization allows the material to resist water absorption while maintaining stable viscosity and thermal properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves reduced water absorption, improved electrical insulation, and stable viscosity under high temperatures, ensuring excellent adhesion to both polar and non-polar substrates, thus maintaining the performance and longevity of electronic components.
Implementation Method 1
an olefin-based-modified polymer (B) which is a grafted polymer produced by polymerizing an olefin, a (meth)acrylic acid ester and an acid anhydride
Implementation Method 2
and grafting a polyamide on a copolymer thereby obtained
Implementation Method 3
A hot melt composition capable of maintaining electrical insulation is used to protect an electronic component
Implementation Method 4
a method for reducing water absorption of a hot melt composition
Data Source
AI summary
The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.