Dimeric Perylene Semiconductors for Stable Solution Processing

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Solution Overview

Problem

The development of organic semiconductor materials, particularly n-type semiconductors, is hindered by the lack of suitable formulations with broad viscosity ranges suitable for solution processing techniques, limiting their application in devices such as printable circuits and photovoltaics.

Innovation Solution

The use of dimeric rylene compounds, including dimeric perylene compounds, which exhibit useful electrical properties and solubility in common solvents, enabling their use in various solution-phase processes like spin-coating and printing, and are stable under ambient conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If n-type organic semiconductor materials are used, then device performance can be improved, but their stability under ambient conditions deteriorates

Engineering Contradiction:
Improvedevice performanceVSAvoidstability under ambient conditions
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent modifies the chemical structure of rylene compounds by introducing specific substituents and forming dimers, which changes the electronic and physical parameters of the material to achieve both high electron mobility and ambient stability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates dimeric rylene compounds that combine multiple functional units into a single molecular structure, achieving synergistic effects that simultaneously provide high electron mobility and environmental stability

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If organic semiconductor materials are formulated for solution processing, then manufacturing cost and ease of fabrication are improved, but the viscosity range suitability deteriorates

Engineering Contradiction:
Improvesolution processing capabilityVSAvoidviscosity range suitability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent modifies molecular parameters such as solubility and viscosity by introducing specific substituents and molecular architectures, enabling the materials to be processed in solutions with broad viscosity ranges suitable for various printing techniques

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If binders are included in semiconductor formulations, then processability is improved, but carrier mobility deteriorates

Engineering Contradiction:
ImproveprocessabilityVSAvoidcarrier mobility
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent removes the need for binder additives by incorporating processing aids directly into the semiconductor molecule itself, eliminating the harmful effect of binders on carrier mobility while maintaining solution processability

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS8569501B2Semiconductor materials and methods of preparation and use thereof
Publication Date: 2013.10.29 USINVEST LLC
  • US8569501B2 patent drawing
  • US8569501B2 patent drawing
  • US8569501B2 patent drawing

AI summary

Disclosed are new semiconductor materials prepared from dimeric perylene compounds. Such compounds can exhibit high n-type carrier mobility and/or good current modulation characteristics. In addition, the compounds of the present teachings can possess certain processing advantages such as solution-processability and/or good stability at ambient conditions.