DIMM Bank Layout for Higher Socket Density and Balanced Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of fitting more dual in-line memory modules (DIMMs) on a server while maintaining efficient thermal cooling, particularly due to the reduced cooling efficiency of downstream DIMMs caused by heated airflow from upstream DIMMs.
Innovation Solution
Positioning DIMMs end-to-end with higher capacity DIMMs upstream and lower capacity DIMMs downstream, and adjusting the spacing between them to compensate for temperature differences in airflow, ensuring both types are adequately cooled.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If more DIMMs are installed per socket to increase memory capacity, then memory capacity is improved, but cooling efficiency deteriorates due to heated airflow from upstream DIMMs
Solution Approach 1:
The patent applies local quality by differentiating the spacing between DIMMs based on their position in the airflow path. Downstream DIMMs are spaced farther apart than upstream DIMMs to compensate for the heated airflow condition. This creates non-uniform spacing that locally optimizes cooling for each position in the sequence, resolving the contradiction between maximizing DIMM density and maintaining cooling efficiency.
2Quantity of substance
If DIMMs are positioned end-to-end to increase number of DIMMs per socket, then memory capacity is improved, but thermal performance becomes non-uniform across different DIMMs
Solution Approach 1:
The patent ensures thermal performance uniformity by applying position-dependent spacing rules. Each DIMM position is assigned an optimal spacing based on its upstream/downstream relationship with other DIMMs. This local optimization compensates for the cumulative heat effect in the airflow, ensuring that all DIMMs maintain acceptable thermal performance despite the end-to-end arrangement.
Solution Approach 2:
The patent changes the spacing parameter dynamically based on DIMM position. By adjusting the physical distance between adjacent DIMMs according to their location in the airflow sequence, the system compensates for thermal conditions and maintains uniform thermal performance across all DIMMs while maximizing the number of DIMMs per socket.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement allows for a significant increase in the number of DIMMs per socket with improved cooling efficiency, maintaining similar thermal performance across all DIMMs by optimizing airflow and capacity positioning.
Implementation Method 1
Positioning DIMMs end-to-end with higher capacity DIMMs upstream and lower capacity DIMMs downstream, and adjusting the spacing between them to compensate for temperature differences in airflow, ensuring both types are adequately cooled.
Data Source
AI summary
Systems, apparatus, articles of manufacture, and methods to increase number of DIMMs per socket and/or enhance cooling of DIMMs are disclosed. An example apparatus includes a circuit board including a first end, a second end opposite the first end, a first lateral edge, and a second lateral edge opposite the first lateral edge. The example apparatus includes a first bank of memory slots to extend between the first and second ends of the circuit board. The first bank of memory slots is a first distance from the first end. The example apparatus also includes a second bank of memory slots to extend between the first and second ends of the circuit board. The second bank of memory slots is a second distance from the first end. The second distance is greater than the first distance.