Integrated DIMM Capacitor Structure for PCB Space and Power Quality
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The limited space on printed circuit boards (PCBs) restricts the arrangement of additional capacitors, adversely affecting power and signal quality in dual-inline-memory-modules (DIMMs), despite the need for improved power quality and signal routing.
Innovation Solution
A capacitor structure is integrated onto the DIMM PCB, with capacitors connected to memory terminals, optimizing power quality by reducing impedance and saving routing space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional capacitors are provided on the DIMM PCB to improve power quality, then power quality is improved, but the routing of signal lines is adversely affected and space is insufficient
Solution Approach 1:
The patent transitions capacitors from a two-dimensional PCB surface arrangement to a three-dimensional structure by mounting capacitors vertically on the PCB surface. This dimensional change allows multiple capacitors to be positioned in the vertical direction, effectively increasing the functional density without occupying additional horizontal PCB area, thus resolving the space constraint while maintaining power quality improvement.
Solution Approach 2:
The patent implements nesting by placing capacitors within or alongside existing PCB structural elements such as memory module slots or connector housings. This nested arrangement integrates the capacitor structure into the existing DIMM form factor, allowing capacitors to be housed within the same physical envelope without increasing the overall footprint, thereby accommodating more capacitors for improved power quality.
2Reliability
If additional capacitors are provided on the DIMM PCB to reduce impedance, then impedance is reduced, but signal line routing is adversely affected
Solution Approach 1:
By positioning capacitors in the vertical dimension rather than spreading them across the PCB surface, the patent minimizes interference with horizontal signal line routing. The vertical placement allows signal lines to pass underneath or alongside capacitor structures without requiring complex rerouting, thus achieving impedance reduction while maintaining signal integrity and routing simplicity.
Solution Approach 2:
The patent applies capacitors locally at specific high-impedance nodes or power delivery critical areas rather than uniformly distributing them across the entire PCB. This localized placement targets impedance issues precisely where they occur, reducing overall impedance without necessitating extensive signal line modifications in areas where capacitors are not needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The capacitor structure enhances power stability and reduces impedance by up to 30%, improving the integration level and maintaining power quality without increasing the PCB's physical size.
Implementation Method 1
The capacitor structure includes a plurality of capacitors, and each of the capacitors has a second power terminal corresponding to the first power terminal and a second ground terminal corresponding to the first ground terminal
Data Source
AI summary
A semiconductor device and a storage system are provided. The semiconductor device includes a first printed circuit board and a capacitor structure positioned on the first printed circuit board. The first printed circuit board includes a plurality of memories arranged in sequence along a first direction, and each of the memories has a first power terminal and a first ground terminal. The capacitor structure includes a plurality of capacitors, and each of the capacitors has a second power terminal corresponding to the first power terminal and a second ground terminal corresponding to the first ground terminal, wherein the first power terminal is electrically connected to the second power terminal, and the first ground terminal is electrically connected to the second ground terminal.