Arrayed DIMM Cold Plate With Rotating Micro-Pipes for Service Access
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Solution Overview
Problem
Existing liquid cooling mechanisms are inadequate for effectively cooling arrays of heat-generating components like DIMMs, as known cold plates are not designed for arrays and complicate access and maintenance.
Innovation Solution
A micro-pipe assembly with a cold manifold, hot manifold, and micro-pipes, positioned by a bracket that can be rotated to allow access to heat-generating components, combined with a cover design that enhances thermal contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air cooling with fan systems is used, then the system structure is simple, but it cannot sufficiently remove heat from next generation processors and DIMMs
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing coolant flow through micro-pipes. The hydraulic system uses liquid coolant circulating through the cold plate to absorb heat from processors and DIMMs, achieving superior thermal performance compared to air cooling systems
Solution Approach 2:
The cold plate design applies different cooling strategies to different components: processors receive cooling through internal cold plate conduits, while DIMMs are cooled through micro-pipes positioned in gaps between modules. This localized approach optimizes heat removal for each component type
2Temperature
If multiple pipes are used to cool arrays of DIMMs, then cooling effectiveness improves, but access to DIMMs for replacement becomes difficult
Solution Approach 1:
The cold plate is designed with rotational capability, allowing it to move between a first position where micro-pipes contact DIMMs for cooling and a second position where DIMMs are accessible for replacement. This dynamic design resolves the conflict between cooling effectiveness and maintenance accessibility
Solution Approach 2:
The cooling system separates the cold plate from the DIMM array, allowing independent movement. The cold plate can be rotated away from the DIMMs to provide access, while the DIMMs remain fixed in their slots for easy insertion and removal
3Temperature
If custom liquid cooling structures are designed for heat-generating components, then cooling performance improves, but the number of parts and assembly complexity increases
Solution Approach 1:
The cold plate serves multiple functions: it cools processors through internal conduits, cools DIMMs through external micro-pipes when in the first position, and can be rotated away to allow access to components. This multi-functionality reduces the need for separate cooling devices for different components
Solution Approach 2:
The patent combines the processor cooling and DIMM cooling functions into a single integrated cold plate assembly. The micro-pipes are integrated with the cold plate structure, eliminating the need for separate cooling mechanisms for processors and DIMMs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient liquid cooling of arrays of components like DIMMs with easy access and maintenance, improving thermal conductivity and system compactness.
Implementation Method 1
Heat generated by the heat source is transferred to the coolant liquid
Implementation Method 2
Liquid cooling is more effective in transporting heat away from a heat source such as a server to an external radiator
Data Source
AI summary
A cooling assembly for liquid cooling of a heat-generating component such as a dual in-line memory module (DIMM) in a computer device is disclosed. The cooling assembly includes a bracket holding a micro-pipe assembly. The micro-pipe assembly has a cold manifold, a hot manifold and a series of micro-pipes. The micro-pipes are fluidly coupled between the cold manifold and hot manifold to allow coolant flow between the cold manifold and the hot manifold. The bracket positions the micro-pipe assembly such that micro-pipes are positioned proximate to opposite sides of the heat-generating component. A coolant inlet supplies coolant to the cold manifold and a coolant outlet collecting coolant from the hot manifold.