DIMM Cooling Assembly With Expandable Cold Plate Contact
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Solution Overview
Problem
High-performance data center computing systems face challenges in thermal management due to increasing heat density, with existing DIMM cooling solutions struggling to efficiently cool semiconductor chips in densely packed configurations, leading to thermal resistance and reduced cooling efficiency.
Innovation Solution
A liquid-cooled DIMM system with a rapidly connectible/disconnectible cold plate design, utilizing an elastic tube with inflatable properties and integrated thermally conductive plates, which expands to press against semiconductor chips, and a self-contained vapor chamber that absorbs heat through boiling and condensation, enhancing thermal contact and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If DIMMs are densely packed to increase computing performance, then productivity increases, but thermal resistance increases and cooling efficiency deteriorates
Solution Approach 1:
The cooling system employs an elastic tube that can dynamically expand and contract based on thermal conditions. When heat is generated by densely packed DIMMs, the elastic tube expands to increase thermal contact area, automatically adapting to the increased thermal load without requiring manual intervention or system reconfiguration.
Solution Approach 2:
The system changes the physical state and dimensions of the cooling elements in response to thermal conditions. The elastic tube's expansion modifies its geometric parameters (volume, surface area, contact pressure), while the phase change material transitions between solid and liquid states, fundamentally altering its thermal conductivity and heat absorption capacity to match the increased thermal load from dense packing.
2Device complexity
If existing cooling solutions are used for densely packed DIMMs, then device complexity remains low, but cooling efficiency deteriorates due to thermal resistance
Solution Approach 1:
The cooling system integrates multiple materials with complementary properties: an elastic tube material that provides both structural integrity and expansion capability, phase change material that offers high latent heat absorption, and thermally conductive components that facilitate heat transfer. This composite approach achieves superior cooling efficiency without significantly increasing overall system complexity.
Solution Approach 2:
The system incorporates phase change material that transitions from solid to liquid state when absorbing heat from the DIMMs. This phase transition occurs at a specific temperature threshold, providing automatic thermal regulation. The latent heat absorption during phase change efficiently manages thermal loads without requiring complex active cooling mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance and improves cooling efficiency by ensuring direct and expansive thermal contact with semiconductor chips, even in densely packed configurations, thereby managing heat effectively in high-performance computing environments.
Implementation Method 1
the tube 101 is composed of elastic material such as rubber. The elasticity of the tube 101 allows the tube to 'inflate' when cooled liquid flows through the tube 101
Implementation Method 2
a self-contained vapor chamber that absorbs heat through boiling and condensation
Implementation Method 3
Coolant flows into the inlet port 102 and is warmed from heat dissipated by semiconductor chips that the tube 101 is in thermal contact with
Implementation Method 4
The warmed fluid then exits the tube from the exit port 103
Data Source
AI summary
Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.