DIMM Cooling Apparatus with Flow Concentrators
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Solution Overview
Problem
Dual in-line memory modules (DIMMs) experience flow starvation due to varying airflow geometries and the presence of vacant slots, leading to component overheating, reduced reliability, and increased noise and power consumption when trying to balance airflow with existing solutions.
Innovation Solution
A planar apparatus with flexible clip legs and arcuate flow concentrators is designed to enhance airflow over DIMMs, using ribs and engagement members to lock onto the DIMM circuit card, directing airflow effectively towards DRAM devices and hub chips, thereby improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fan output is increased to offset flow bypass imbalance, then cooling performance is improved, but acoustic noise level increases
Solution Approach 1:
The patent applies local quality by using flow concentrators positioned specifically over hub chips and engagement members that create localized flow resistance. This directs cooling airflow precisely where needed (DRAM devices and hub chips) rather than increasing overall fan output, thereby improving cooling performance without generating excessive acoustic noise throughout the system.
Solution Approach 2:
The engagement members and flow concentrators act as intermediary elements between the fan and the DIMM components. These intermediaries redistribute the airflow locally, creating flow balance without requiring increased fan output, thus avoiding the acoustic noise penalty associated with higher fan speeds.
2Temperature
If fan output is increased to offset flow bypass imbalance, then cooling performance is improved, but electrical power consumption increases
Solution Approach 1:
The flow concentrators and engagement members create localized flow resistance directly at the DIMM level, improving cooling efficiency where needed without requiring system-wide increases in fan power consumption. This targeted approach reduces the electrical energy required compared to increasing overall fan output.
3Ease of operation
If foam blocks are used to obstruct open channels, then flow balance is improved, but overall system pressure drop increases
Solution Approach 1:
Instead of using foam blocks that create broad obstruction and high pressure drop, the patent uses engagement members with tabs that engage mounting latch recesses to create localized flow resistance. This achieves flow balance by directing air through specific paths (over DRAM devices and hub chips) without creating system-wide pressure drop penalties.
Solution Approach 2:
The patent extracts the flow balancing function from passive foam block obstructions and implements it through engineered engagement members with flow concentrators. This extraction allows for controlled, localized flow resistance that achieves balance without the excessive pressure drop associated with foam block obstructions.
4Ease of operation
If foam blocks are used to obstruct open channels, then flow balance is improved, but downstream or upstream components heat up
Solution Approach 1:
The flow concentrators are specifically positioned to direct airflow over hub chips and DRAM devices, ensuring that flow balance improvements do not come at the expense of downstream or upstream component heating. The engagement members with tabs engage mounting latch recesses to create localized resistance that guides air through critical cooling paths without creating upstream backpressure that would heat other components.
5Ease of operation
If prior art fillers are used, then some flow balancing is achieved, but cooling to hub chips is insufficient
Solution Approach 1:
The patent enhances flow balancing by adding flow concentrators specifically positioned over hub chips, creating localized flow resistance and direction that targets hub chip cooling. The engagement members with tabs that engage mounting latch recesses work in conjunction with these flow concentrators to ensure adequate airflow delivery to hub chips, addressing the specific cooling deficiency of prior art fillers.
Solution Approach 2:
The flow concentrators act as intermediary elements between the general airflow and the hub chips, specifically directing and concentrating cooling airflow over the hub chip surface. This intermediary function ensures adequate cooling to hub chips without requiring excessive overall airflow rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively balances airflow across DIMMs, reducing overheating and noise while maintaining efficient cooling, even with mixed height configurations and hub chips, by directing airflow precisely over critical components.
Implementation Method 1
The first and second clip legs may be flexible
Implementation Method 2
A first flow concentrator may be connected to one surface of the body and a second flow concentrator may be connected to the opposite surface of the body. The first and second flow concentrators may be arcuate.
Data Source
AI summary
An apparatus for enhancing the cooling of a dual in-line memory module (DIMM) includes a planar body having opposing surfaces, a top edge, a bottom edge, and opposing ends. An engagement flange is connected to the bottom edge of the body. A first clip leg is connected to the engagement flange. The first clip leg includes a tab arranged to engage one mounting latch recess of the DIMM. A second clip leg connected to the engagement flange. The second clip leg includes a tab arranged to engage the other mounting latch recess of the DIMM.