DIMM Cooling Heat Spreader Anti-Rotation Mechanism
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Solution Overview
Problem
The existing DIMM cooling assemblies face challenges in maintaining alignment and thermal efficiency due to heat spreader rotation, which leads to air gaps and increased thermal resistance, causing balance issues and potential electrical connection problems.
Innovation Solution
A compressive force mechanism is applied at the edges of the DIMM to prevent heat spreader rotation, using through holes and screws or clips to create counter-torque and ensure proper alignment and contact with chip package lids, thereby maintaining thermal efficiency and balance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat spreaders are placed on DIMM to improve heat dissipation, then thermal efficiency is improved, but heat spreader rotation occurs causing air gaps and increased thermal resistance
Solution Approach 1:
The patent applies preliminary anti-action by using retention mechanisms (clips, tabs, or adhesive elements) that pre-counteract the rotational force before air gaps can form. These mechanisms are positioned to engage with the heat spreader edges or corners, creating opposing torque that prevents rotation from occurring in the first place, thereby maintaining consistent thermal contact between the heat spreader and chip package lids throughout operation
Solution Approach 2:
The patent employs asymmetry by designing retention mechanisms with asymmetric geometry that specifically counteracts the rotational tendency. The clips have asymmetric engagement surfaces, tabs are positioned at specific asymmetric locations on the heat spreader, and adhesive elements are placed at strategic asymmetric positions to maximize resistance against rotational moments while maintaining thermal contact pressure
2Stability of the object's composition
If heat spreader rotation is prevented using retention mechanisms, then alignment stability is improved, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the retention function into multiple discrete elements distributed around the heat spreader perimeter. Instead of one complex centralized mechanism, multiple simpler retention features (clips at corners, tabs at edges, or distributed adhesive elements) work independently to collectively prevent rotation, reducing overall complexity while maintaining effectiveness
Solution Approach 2:
The patent employs self-service by designing retention mechanisms that automatically engage and counteract rotation without requiring external control systems. The clips self-latch onto the heat spreader, tabs self-align during assembly, and adhesive elements self-bond, allowing the cooling assembly to maintain alignment stability through its own inherent structural properties rather than active control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents heat spreader rotation, ensuring consistent thermal contact and reducing thermal resistance, thus maintaining system balance and electrical connectivity.
Implementation Method 1
A compressive force mechanism is applied at the edges of the DIMM to prevent heat spreader rotation, using through holes and screws or clips to create counter-torque
Implementation Method 2
A compressive force mechanism is applied at the edges of the DIMM to prevent heat spreader rotation
Implementation Method 3
heat generated by the chips is transferred to the heat spreaders with sufficient efficiency
Implementation Method 4
heat is more efficiently transferred from the chips to the DIMM's ambient with the heat spreaders in place
Data Source
AI summary
An apparatus is described. The apparatus includes a DIMM cooling assembly. The DIMM cooling assembly includes first and second heat spreaders to be respectively disposed on first and second sides of the DIMM's circuit board. The first and second sides having respective memory chips. The DIMM cooling assembly includes a heat dissipative structure. The DIMM's circuit board is to be disposed between the heat dissipative structure and a printed circuit board that the DIMM is to be plugged into. The DIMM cooling assembly includes fixturing elements to apply compressive forces toward the respective side edges of the DIMM's circuit board to the heat spreaders.