DIMM Temperature Sensing Module With FPC Sensor and Heating Pad

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Solution Overview

Problem

Accurately monitoring and reporting the temperature of dual inline memory modules (DIMMs) in information handling systems is desirable to ensure proper operation, especially during system boot-up, as existing systems may not efficiently adjust DIMM temperatures to operating ranges.

Innovation Solution

A temperature sensing module with a flexible printed circuit (FPC) and integrated sensor is used to contact DIMMs, collecting temperature data and adjusting it using a heating pad to maintain operating temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a temperature sensor is integrated into the FPC to contact DIMMs, then temperature measurement precision is improved, but device complexity increases

Engineering Contradiction:

Improvetemperature measurement precisionVSAvoiddevice complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The temperature sensor is integrated directly into the FPC structure, merging the sensing function with the existing circuit board. This integration approach improves measurement precision by placing the sensor in direct contact with the DIMM while avoiding the need for separate, complex sensing assemblies.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The FPC itself acts as an intermediary structure that facilitates temperature sensing. By integrating the sensor into the FPC, the system uses the existing flexible circuit as a mediator to achieve precise temperature measurement without adding complex external sensing mechanisms.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If temperature monitoring and adjustment capability is added to DIMMs, then reliability is improved, but device complexity increases

Engineering Contradiction:

ImproveDIMM operation reliabilityVSAvoidDIMM structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The FPC serves multiple functions: it provides electrical connections to the DIMM and simultaneously houses the temperature sensor. This multi-functionality approach improves reliability through temperature monitoring while avoiding the need for separate dedicated sensing components that would increase complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system uses the existing FPC infrastructure to provide temperature sensing capabilities. Rather than adding completely separate monitoring systems, the invention leverages the existing flexible circuit structure to serve the additional function of temperature measurement, thereby improving reliability without proportionally increasing complexity.

Inventive Principle:

Principle #25Self-service

3Productivity

If temperature adjustment is performed during system boot-up, then productivity is improved, but use of energy increases

Engineering Contradiction:

Improvesystem boot-up speedVSAvoidenergy consumption during boot-up

Core Design Contradiction:

ProductivityVSUse of energy by moving object

Solution Approach 1:

Temperature monitoring begins immediately during system boot-up, allowing early detection of temperature conditions. This preliminary action enables the system to proactively adjust temperatures as needed, improving boot-up productivity by preventing delays while managing energy consumption through targeted, condition-based heating rather than continuous operation.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The temperature sensor provides continuous feedback during the boot-up process, allowing the system to dynamically adjust heating pad operation based on actual temperature conditions. This feedback mechanism improves productivity by enabling rapid temperature optimization while managing energy consumption through responsive, demand-based heating control.

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures timely and accurate temperature adjustment of DIMMs, enabling faster system operation by maintaining optimal operating conditions.

Implementation Method 1

a temperature sensor integrated into the FPC, wherein the temperature sensor is configured to contact and receive temperature the DIMM

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

adjusting the heat of a heating pad until collected temperature data is within the operating temperature of the DIMM

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12480821B2Temperature sensor for dual inline memory modules (DIMM)

Publication Date: 2025.11.25 DELL PROD LP

AI summary

Described herein is a temperature sensing module for determining and adjusting temperature of dual inline memory module (DIMM) of an information handling system. The temperature sensing module includes a flexible printed circuit (FPC) and a temperature sensor integrated into the FPC. The temperature sensor is configured to contact and receive temperature the DIMM. The received temperature is used to adjust temperature of the DIM by heating a heating pad. Fasteners are to connect the temperature sensing module to the DIMM.