Two-Sided DIMM Heat Pipe Cooling for Server Memory Thermal Limits

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Solution Overview

Problem

Existing dual in-line memory module (DIMM) cooling systems face inefficiencies due to heat being dissipated from only one side of the DIMM, leading to reduced thermal design power and increased noise levels, especially in high-performance applications like data center servers.

Innovation Solution

A two-sided heat pipe heatsink design that thermally contacts DRAM chips on both sides of the DIMM, utilizing two separate heatsink bases and heat pipes to reduce the heat transfer path and enhance thermal dissipation, while maintaining the same assembly size as one-sided heatsinks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If one-sided heatsink design is used, then device complexity is reduced, but thermal dissipation efficiency deteriorates

Engineering Contradiction:

Improveheatsink structureVSAvoidthermal dissipation efficiency

Core Design Contradiction:

Device complexityVSLoss of energy

Solution Approach 1:

The heatsink is divided into two separate bases, each thermally coupled to one side of the DIMM. This segmentation allows independent optimization of each base's thermal contact with the memory chips, enabling efficient heat extraction from both sides of the DIMM simultaneously, thereby resolving the contradiction between structural simplicity and thermal efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from a conventional single-sided cooling approach to a dual-sided cooling architecture by adding thermal contact on the opposite side of the DIMM. This dimensional expansion from one-sided to two-sided heat extraction fundamentally improves thermal dissipation efficiency without significantly increasing overall device complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If one-sided heatsink design is used, then manufacturing cost is reduced, but noise level increases

Engineering Contradiction:

Improvemanufacturing costVSAvoidnoise level

Core Design Contradiction:

Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

By segmenting the cooling function across two bases contacting opposite sides of the DIMM, the thermal load on each individual cooling path is reduced. This allows for more efficient heat distribution and can enable the use of quieter cooling mechanisms while maintaining effective thermal management.

Inventive Principle:

Principle #1Segmentation

3Loss of energy

If two-sided heatsink design is used, then thermal dissipation efficiency is improved, but device complexity increases

Engineering Contradiction:

Improvethermal dissipation efficiencyVSAvoidheatsink structure

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent describes that the two bases can be nested or stacked in a configuration that minimizes the overall footprint and space requirements. This nesting approach allows the dual-sided cooling functionality to be integrated into a compact form factor, reducing the apparent increase in device complexity while maintaining the thermal benefits.

Inventive Principle:

Principle #7Nested doll (Nesting)

4Loss of energy

If two-sided heatsink design is used, then thermal dissipation efficiency is improved, but assembly complexity increases

Engineering Contradiction:

Improvethermal dissipation efficiencyVSAvoidassembly process

Core Design Contradiction:

Loss of energyVSEase of operation

Solution Approach 1:

The patent incorporates alignment features and pre-configured thermal interface structures that guide the assembly process. The bases are designed with integrated alignment mechanisms that automatically position them correctly relative to the DIMM and to each other, reducing the skill level and time required for assembly while maintaining the thermal performance benefits of the two-sided design.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The two-sided heatsink design improves thermal dissipation by up to 15.4% for DIMMs operating at 12 W, 8.8% for 18 W, and 11.5% for 30 W, maintaining DIMM temperatures within safe limits and enabling higher density DIMMs without increasing size.

Implementation Method 1

A two-sided heat pipe heatsink design that thermally contacts DRAM chips on both sides of the DIMM, utilizing two separate heatsink bases and heat pipes to reduce the heat transfer path

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

the first heatsink base supporting a heat pipe, positioned adjacent a first side of a dual in-line memory module (DIMM), the first heatsink base providing thermal contact to memory chips on the first side of the DIMM

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250324548A1Methods and apparatus for cooling of dual in-line memory modules

Publication Date: 2025.10.16 INTEL CORP

AI summary

Methods and apparatus for cooling of dual in-line memory modules are disclosed. An example apparatus includes: a heat pipe, and a first base to house the heat pipe. The first base is to be thermally coupled to a first side of a dual in-line memory module (DIMM). The example apparatus further includes a second base to be thermally coupled to a second side of a DIMM. The second side is opposite the first side. The second base is to be thermally coupled to the first base.