Spring-Loaded DIMM Retention Latch for Shock-Resilient Connectors
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Solution Overview
Problem
The increasing mass of dual-inline memory modules (DIMMs) due to higher bandwidth and capacity, along with the use of 3D crosspoint memory components, leads to increased risk of mechanical shock-induced failures such as broken latches and solder joint failures in DIMM connectors, particularly due to excessive board deflection and stress.
Innovation Solution
A spring mechanism is integrated into the DIMM latch design that allows the latch to extend under shock load and reseat the DIMM back into the connector, providing shock absorption and reducing the risk of connector damage, while maintaining the motherboard's routing integrity without the need for system-level shock mitigation solutions like dampers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the mass of DIMM is increased to provide higher bandwidth and capacity, then the memory performance is improved, but the risk of mechanical shock-induced failures increases
Solution Approach 1:
A spring mechanism is integrated into the latch assembly to provide pre-positioned shock absorption. The spring is configured to compress and extend in response to shock loads, cushioning the impact before it reaches critical components such as solder joints and connector housing, thereby preventing shock-induced failures
2Ease of manufacture
If traditional rigid latch designs are used, then the manufacturing simplicity is maintained, but the shock absorption capability is insufficient
Solution Approach 1:
The latch assembly is transformed from a rigid structure to a dynamic system incorporating a spring mechanism. The spring allows the latch to move and absorb shock energy dynamically, while the overall manufacturing process remains simple through the use of standard spring components and straightforward assembly procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The spring mechanism effectively mitigates DIMM connector failures by allowing board flexure and preventing latch fracture and solder joint pull-outs, reducing the risk of DIMM ejection and connector housing damage, thus enhancing reliability and reducing costs compared to traditional shock mitigation methods.
Implementation Method 1
A spring mechanism is integrated into the DIMM latch design that allows the latch to extend under shock load and reseat the DIMM back into the connector, providing shock absorption
Data Source
AI summary
An embodiment of a latch apparatus for a circuit board comprises a first latch body with a retention mechanism for the circuit board, a second latch body with a coupling mechanism for a connector, and a spring mechanism mechanically coupled between the first latch body and the second latch body. Other embodiments are disclosed and claimed.