DIMM Notch Retention with Flexible Chassis Supports
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Solution Overview
Problem
The increasing number of dual-in-line memory modules (DIMMs) on a platform leads to mechanical shock risks during shipping and handling, causing motherboard deflection and DIMM latch connector failures due to the weight and vibration of the modules.
Innovation Solution
The implementation of DIMMs with notches along their top edge that engage with flexible supports mounted on the chassis, which absorb shock and vibration loads, reducing the stress on the motherboard and DIMM connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of DIMMs on a platform is increased to meet memory capacity demands, then memory capacity is improved, but the total DIMM mass and mechanical shock risk increase
Solution Approach 1:
The patent applies beforehand cushioning by introducing shock-absorbing materials and compliant mounting structures between the DIMMs and the motherboard before mechanical shock occurs. These pre-installed cushioning elements absorb impact energy during shipping and handling, preventing direct transmission of shock forces to the DIMM connectors and solder joints, thereby maintaining reliability while allowing increased DIMM density
2Quantity of substance
If the number of DIMMs on a platform is increased, then memory capacity is improved, but motherboard deflection and connector failure risk increase
Solution Approach 1:
The patent employs flexible shells and thin films through the use of compliant mounting structures, flexible retainers, and elastic shock-absorbing materials that conform to the DIMM edges and connector interfaces. These flexible elements absorb mechanical stress and prevent rigid force transmission to the latch connectors and solder joints, thereby maintaining connector reliability while supporting increased DIMM capacity
3Reliability
If DIMMs are securely retained on the motherboard, then connection reliability is improved, but shock and vibration loads on the motherboard increase
Solution Approach 1:
The patent introduces intermediary shock-absorbing elements and compliant mounting structures between the DIMMs and the motherboard. These intermediaries maintain secure electrical connections while decoupling the mechanical shock and vibration loads from the motherboard, allowing reliable retention without transmitting excessive forces to the board structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the incidence of broken DIMM connector latches and solder joint leads, minimizing damage to the motherboard by distributing the weight and vibration loads across the chassis, thereby enhancing the mechanical stability of the memory modules.
Implementation Method 1
engage with the one or more notches to assist in retention of the DIMM in the chassis to reduce a shock or vibration associated with a load of the plurality of DIMMs on the PCB
Implementation Method 2
engage with the one or more notches to assist in retention of the DIMM in the chassis to reduce a shock or vibration associated with a load of the plurality of DIMMs on the PCB
Data Source
AI summary
Embodiments are directed towards apparatuses, methods, and systems for a memory module, e.g., a dual in-line memory module (DIMM) including a first lengthwise edge along the DIMM and a second lengthwise edge, opposite the first lengthwise edge, to couple the DIMM with a printed circuit board (PCB). In embodiments, the DIMM includes one or more notches along the first lengthwise edge, to removeably couple with one or more flexible supports located at least partially along a length or width of a chassis and to engage the notches to assist in retention of the DIMM in the chassis to reduce a shock and/or vibration associated with a load of a plurality of DIMMs on the PCB. In some embodiments, the one or more flexible supports are coupled to a support structure, such as a pole mounted or otherwise coupled to a panel of the chassis. Additional embodiments may be described and claimed.