DIMM Heatsink Pedestals With Sliding TIM Pads for Dense Memory Cooling
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Solution Overview
Problem
The increasing thermal design power and number of Dual In-line Memory Modules (DIMMs) pose challenges in maintaining temperatures within thermal specification limits, particularly for RDIMMs, MRDIMMs, and SIMMs, with existing cooling solutions like increased air flow velocity and liquid cooling being inadequate.
Innovation Solution
The implementation of heatsinks with thermally conductive fins and pedestals, combined with sliding thermal interface material (TIM) pads, enhances heat dissipation and distribution without increasing air flow velocity or reducing air inlet temperature, and includes features like vapor chambers for improved cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If common cooling solutions (increased air flow velocity, reduced air temperature, liquid cooling) are used, then cooling performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The heatsink is divided into multiple independent pedestals (first pedestal, second pedestal, third pedestal, fourth pedestal) that can be separately positioned and adjusted. Each pedestal can be independently adjusted to make contact with the corresponding DIMM module, allowing for modular assembly and easier manufacturing while maintaining effective thermal contact with all heat-generating components.
Solution Approach 2:
The pedestals are designed with adjustable positioning capabilities, allowing them to be moved between different positions to accommodate variations in DIMM module placement and thermal contact requirements. This dynamic adjustment feature enables the cooling system to adapt to different configurations without requiring complex custom-designed components for each scenario.
2Temperature
If heat spreaders and improved air distribution systems are added, then cooling efficiency is enhanced, but manufacturing feasibility and field serviceability become more difficult
Solution Approach 1:
The heatsink structure serves multiple functions simultaneously: the pedestals provide both structural support for the DIMM modules and thermal conduction paths for heat dissipation. The same components that position the modules also serve as heat sinks, eliminating the need for separate mounting structures and simplifying manufacturing while maintaining cooling effectiveness.
Solution Approach 2:
The cooling function and structural support function are merged into a single integrated heatsink assembly. The pedestals simultaneously provide mechanical positioning and thermal management, reducing the total number of components and simplifying both manufacturing and field serviceability compared to separate cooling and support structures.
3Reliability
If more pedestals and thermal contact points are added, then thermal connection is improved, but device complexity increases
Solution Approach 1:
Thermal contact is optimized at specific localized points where the pedestals make direct contact with the DIMM modules. Rather than requiring broad surface contact throughout the entire structure, the design concentrates thermal conduction at the critical interface points between pedestals and modules, achieving reliable thermal connection with a simpler structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed system achieves a temperature reduction of 5°C to 15°C cooler at the same incoming air flow rate and temperature, balancing field serviceability and manufacturing feasibility.
Implementation Method 1
The plurality of thermally conductive fins extend in a first direction away from the base. The plurality of pedestals extend in a second direction away from the base and opposite the first direction.
Implementation Method 2
Common cooling solutions include increasing the approaching air flow velocity, reducing the approaching air temperature for air cooling
Implementation Method 3
The sliding TIM pads provide thermal connections between the plurality of pedestals and an adjacent in-line memory module when the plurality of pedestals contact the sliding TIM pads
Data Source
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AI summary
A system for cooling a plurality of in-line memory modules includes sliding thermal interface material ("TIM") pads and a heatsink thermally coupled to the in-line memory modules through the sliding TIM pads. The heatsink further includes a base, a plurality of thermally conductive fins, and a plurality of pedestals. The base extends in a plane. The plurality of thermally conductive fins extend in a first direction away from the base. The plurality of pedestals extend in a second direction away from the base and opposite the first direction. The sliding TIM pads are positioned between each of the plurality of pedestals and an adjacent in-line memory module. The plurality of pedestals further include a first leg and a second leg. The first and second legs are configured to move between a first position and a second position.