DIMM RAS Controller Using Repurposed Pins for Host Feedback
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Solution Overview
Problem
Traditional memory reliability, availability, and serviceability (RAS) features are managed at a system level by the CPU/MC, which can lead to inefficiencies and increased power consumption.
Innovation Solution
A memory module with an integrated controller that manages in-module refresh, ECC, scrubbing, and wear-leveling operations, communicating RAS feedback status information through repurposed connector pins to coordinate with the host device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If RAS features are managed at system level by CPU/MC, then centralized control is achieved, but power consumption increases and system performance decreases
Solution Approach 1:
The patent segments RAS management functions from the centralized CPU/MC and distributes them to individual memory modules. Each memory module contains its own controller that independently manages refresh, ECC, scrubbing, and wear-leveling operations, eliminating the need for continuous CPU/MC intervention and reducing system-wide power consumption.
Solution Approach 2:
The memory module controller is designed to autonomously perform RAS operations without requiring CPU/MC involvement. The controller monitors memory array status, executes refresh cycles, performs error correction, and manages wear-leveling independently, allowing the memory subsystem to serve itself and reducing the power burden on the CPU/MC.
2Productivity
If RAS features are managed at system level by CPU/MC, then comprehensive monitoring is achieved, but system performance and efficiency decrease
Solution Approach 1:
The patent implements a feedback mechanism where the memory module controller communicates RAS status information (error counts, refresh status, wear-leveling state) back to the CPU/MC through repurposed connector pins. This allows the CPU/MC to monitor memory health without actively managing operations, maintaining visibility while improving performance.
Solution Approach 2:
The connector pins between memory module and CPU/MC are repurposed to carry both traditional memory control signals and RAS feedback status information. This multi-functional use of existing physical interfaces enables comprehensive monitoring without adding dedicated communication channels that would increase complexity.
Data Source
AI summary
A memory module includes a memory array, an interface and a controller. The memory array includes an array of memory cells and is configured as a dual in-line memory module (DIMM). The DIMM includes a plurality of connections that have been repurposed from a standard DIMM pin out configuration to interface operational status of the memory device to a host device. The interface is coupled to the memory array and the plurality of connections of the DIMM to interface the memory array to the host device. The controller is coupled to the memory array and the interface and controls at least one of a refresh operation of the memory array, control an error-correction operation of the memory array, control a memory scrubbing operation of the memory array, and control a wear-level control operation of the array, and the controller to interface with the host device.