DIMM Thermal Layout for Heat-Aware Semiconductor Die Placement
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Solution Overview
Problem
As semiconductor devices such as DDR RAM and NAND-type flash memory devices experience increased operating temperatures due to shrinking footprints and higher processing speeds, leading to impaired performance and increased power consumption, along with higher frequencies of die failure, existing technologies fail to effectively manage heat and mitigate temperature-related issues.
Innovation Solution
The solution involves constructing a dual in-line memory module (DIMM) with a substrate having distinct array areas, where heat-generating components like the PMIC are mounted centrally, and semiconductor dies are strategically placed based on their temperature sensitivity, with more temperature-affected dies positioned upstream and less affected dies downstream relative to airflow, to optimize performance and reduce thermal impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are shrunk in footprint and processing speed is increased, then device capacity and speed are improved, but operating temperature increases leading to impaired performance and increased power consumption
Solution Approach 1:
The patent applies local quality by creating distinct array areas with different thermal characteristics on the DIMM substrate. The first array area is designed to be cooler than the second array area, allowing different semiconductor dies to be placed in optimally cooled locations based on their temperature sensitivity requirements.
Solution Approach 2:
The patent introduces spatial dimensionality to heat management by dividing the substrate into multiple array areas with different thermal zones. Instead of uniform heat distribution, the design creates a thermal gradient across the substrate surface, enabling strategic placement of temperature-sensitive components in cooler regions.
2Quantity of substance
If semiconductor dies are mounted closer together to increase capacity, then device capacity is improved, but temperature management becomes more difficult and die failure increases
Solution Approach 1:
The patent applies local quality by creating distinct array areas with different thermal characteristics on the DIMM substrate. The first array area is designed to be cooler than the second array area, allowing different semiconductor dies to be placed in optimally cooled locations based on their temperature sensitivity requirements.
3Temperature
If additional cooling mechanisms are added to manage heat, then temperature control is improved, but device complexity and space consumption increase
Solution Approach 1:
The patent applies self-service by designing the DIMM to manage its own heat distribution through strategic component placement and substrate design. The system uses natural convection and the inherent thermal properties of the substrate to create cooler and hotter zones, eliminating the need for active cooling mechanisms while still achieving effective temperature management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the overall performance and retention of semiconductor dies by managing temperature gradients, reducing power consumption, and minimizing die failure rates without the need for additional cooling mechanisms that would consume space and power.
Implementation Method 1
a first array area on one side of the central portion and a second array area on an opposite side of the central portion. In operation of the DIMM, the first array area is cooler than the second array area
Data Source
AI summary
An improved memory module and methods for constructing the same are disclosed herein. The memory module includes a substrate having a first surface and a second surface opposite the first surface, each having a central portion, a first array area and a second array area. The first array area is cooler than the second array area during operation. The memory module also includes a power management integrated circuit attached to the central portion of the first surface. The memory module also includes a first semiconductor die attached to the substrate in the first array area. The first semiconductor die has a first performance rating of an operating parameter at high temperatures. The memory module also includes a second semiconductor die attached to the substrate in the second array area. The second semiconductor die has a second performance rating of an operating parameter better than the first performance rating at high temperatures.