Dimming Window Bonding Region Design for Hole-Free Circuit Connection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing smart dimming windows require manual drilling to avoid bonding circuits, which is time-consuming and has a high breakage rate due to the difficulty in drilling holes in both substrates simultaneously.
Innovation Solution
The dimming window design includes a first substrate with a single substrate region exceeding the second substrate, featuring a patterned bonding region with separated sub-regions for connecting driving circuits, eliminating the need for hole drilling by using a conductive connection via a conductive adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual drilling is used to create avoidance holes in both substrates for bonding circuit connections, then the bonding circuits can be connected, but the process time increases and the breakage rate increases
Solution Approach 1:
The patent extracts the bonding function from the substrate interior to the substrate edge. By extending the first substrate beyond the second substrate to create a single substrate region, the bonding circuits can be connected directly at the edge without requiring holes to be drilled through both substrates. This separates the bonding operation from the hole-drilling process, eliminating the need for precise hole alignment and manual drilling operations.
2Reliability
If avoidance holes are defined in both substrates for bonding circuit connection, then the bonding can be achieved, but the process complexity increases due to the need for precise hole alignment
Solution Approach 1:
The patent removes the complexity of hole alignment by extracting the bonding connection from the substrate interior to the substrate edge. The single substrate region extends beyond the second substrate, allowing bonding circuits to connect directly at the edge without requiring holes to be drilled and aligned through both substrates. This simplifies the bonding process by eliminating the hole-drilling and alignment steps entirely.
3Reliability
If manual drilling is used for substrate holes, then bonding circuit connections can be made, but the breakage rate increases
Solution Approach 1:
The patent extracts the bonding connection from the substrate interior to the edge region, eliminating the need to drill holes through the substrates. By extending the first substrate beyond the second substrate to create a single substrate region, bonding circuits can be connected directly at the edge using conductive adhesive, avoiding mechanical drilling operations that create stress concentrations and increase breakage risk.
4Adaptability or versatility
If entire substrate is covered with transparent conductive film without mask design, then various dimensions and shapes can be accommodated, but the bonding region patterning becomes more complex
Solution Approach 1:
The patent applies local quality by creating a patterned bonding region with specific sub-regions within the transparent conductive film layer. The bonding region includes a first sub-region for bonding to the first driving circuit and a second sub-region for bonding to the second driving circuit, with each sub-region having distinct functionality. This localized patterning provides clear guidance for bonding operations while maintaining the overall versatility of the entire-substrate approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces process difficulty and time, improves yield by eliminating manual drilling, and ensures reliable bonding of driving circuits without the need for precise hole alignment.
Implementation Method 1
the second sub-region is in conductive connection with the second transparent conductive layer
Data Source
AI summary
The present disclosure provides a dimming window and a method for manufacturing the same. The dimming window includes a cell defined by a first substrate and a second substrate, where at least one side edge of the first substrate exceeds an outside of the second substrate, and a part of the first substrate that exceeds the second substrate serves as a single substrate region; a first transparent conductive layer on one side of the first substrate facing the second substrate; a second transparent conductive layer on one side of the second substrate facing the first substrate; and a liquid crystal layer between the first substrate and the second substrate. The first transparent conductive layer includes a bonding region at the single substrate region; and a pattern of the bonding region includes a first sub-region and a second sub-region which are separated from each other;the first sub-region is in a binding connection with a first driving circuit which drives the first substrate, and the second sub-region is in a binding connection with a second driving circuit which drives the second substrate; and the second sub-region is in conductive connection with the second transparent conductive layer. The dimming window and the method for manufacturing the same in the present disclosure can eliminate the need to drill holes in substrates, reduce process difficulty, reduce time consumption and improve product yield.