DIMM Hub Circuit Segments MIPI I3C Bus to Reduce Capacitive Loading
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Solution Overview
Problem
In system memory designs, increasing performance and functionality often lead to slower throughput due to the need to communicate with multiple components, which increases capacitive loading on buses like the MIPI I3C bus, making it difficult to send high-speed signals effectively.
Innovation Solution
Implementing a hub circuit on each DIMM to break the MIPI I3C bus into a 'host side' and 'local' bus, allowing the hub to act as a gateway for targeted components, reducing overall bus loading and eliminating the need for redundant communication commands, thus improving communication efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are added to DIMM to improve functionality, then performance and functionality are improved, but throughput decreases due to increased capacitive loading on the bus
Solution Approach 1:
The patent segments the communication path by introducing a hub circuit that divides the bus into a host side bus and a local bus. This segmentation isolates the capacitive loading of multiple components (EEPROM, temperature sensor, power management IC) from the main MIPI I3C bus, allowing the bus to maintain high-speed signal integrity while supporting enhanced functionality.
Solution Approach 2:
The hub circuit acts as an intermediary between the host and the multiple components on the DIMM. It receives commands from the host over the host side bus, routes them to the appropriate local bus, and manages communication with targeted components, thereby reducing overall bus loading and maintaining throughput.
2Adaptability or versatility
If multiple components are communicated with over the MIPI I3C bus, then functionality is improved, but signal integrity deteriorates due to increased capacitive loading
Solution Approach 1:
The patent segments the communication path by introducing a hub circuit that divides the bus into a host side bus and a local bus. This segmentation isolates the capacitive loading of multiple components (EEPROM, temperature sensor, power management IC) from the main MIPI I3C bus, allowing the bus to maintain high-speed signal integrity while supporting enhanced functionality.
3Device complexity
If a multi-drop bus architecture is used to connect multiple components, then device complexity is reduced, but communication efficiency decreases due to redundant commands and bus conflicts
Solution Approach 1:
The patent segments the communication path by introducing a hub circuit that divides the bus into a host side bus and a local bus. This segmentation isolates the capacitive loading of multiple components (EEPROM, temperature sensor, power management IC) from the main MIPI I3C bus, allowing the bus to maintain high-speed signal integrity while supporting enhanced functionality.
Solution Approach 2:
The hub circuit acts as an intermediary between the host and the multiple components on the DIMM. It receives commands from the host over the host side bus, routes them to the appropriate local bus, and manages communication with targeted components, thereby reducing overall bus loading and maintaining throughput.
Data Source
AI summary
An apparatus is described. The apparatus includes a DIMM hub circuit. The DIMM hub circuit includes first bus interface circuitry, control circuitry and second bus interface circuitry. The first bus interface circuitry is to receive header information and payload information from a host. The control circuitry is to process the header information and recognize that the payload is to be passed to a target component that is coupled to the DIMM hub circuit through a second bus that is a same type of bus as the first bus. The second bus interface circuitry to send the payload information over the second bus to the target component, wherein, the payload information is to include embedded header information to be processed by the target component.