Heat Spreader With Openings For DIMM Thermal Management
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Solution Overview
Problem
The high heat generated by the controller in a dual in-line memory module (DIMM) affects its performance, and traditional heat plates that reduce the controller's surface temperature inadvertently increase the surface temperature of the memory device, compromising the module's performance.
Innovation Solution
A heat spreader with distinct portions positioned over the controller and memory device, featuring openings that allow air flow to enhance cooling, preventing overheating of the memory device while effectively dissipating heat from the controller.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a heat plate is used to cool the controller, then heat dissipation is improved, but the memory device temperature increases due to heat transfer
Solution Approach 1:
The harmful thermal coupling between the controller and memory device is extracted by introducing openings in the heat spreader. These openings remove the direct thermal conduction path that would otherwise transfer heat from the controller to the memory device, allowing independent thermal management of each component.
Solution Approach 2:
The heat spreader acts as an intermediary structure with openings that mediate between the heat-generating controller and the heat-sensitive memory device. The openings serve as thermal barriers while the heat spreader material still provides some heat dissipation function, creating a balanced thermal interface.
2Loss of energy
If a solid heat spreader is used without openings, then heat dissipation is maximized, but air flow for cooling is restricted
Solution Approach 1:
The heat spreader incorporates openings that create a porous-like structure, allowing air to flow through while still providing thermal conduction. This enables simultaneous heat dissipation through the spreader material and convective cooling through the openings, optimizing both heat transfer mechanisms.
Solution Approach 2:
The openings in the heat spreader facilitate pneumatic cooling by allowing air to flow directly to the controller. The air flow through the openings provides convective cooling that complements the conductive heat dissipation through the heat spreader material, enhancing overall cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves cooling performance by facilitating air flow, maintaining the memory device's lower surface temperature and enhancing the overall performance of the electronic module.
Implementation Method 1
the heat spreader is disposed on the controller and the memory device... cooling performance of the heat spreader can be improved
Implementation Method 2
the first opening is beneficial for the air to flow to the controller, cooling performance of the heat spreader can be improved
Data Source
AI summary
A electronic module includes a printed circuit board (PCB) substrate, a controller substrate, a controller, a memory device, and a heat spreader. The controller is disposed on the controller substrate. The memory device is disposed on the PCB substrate. The heat spreader is disposed on the controller and the memory device, in which the heat spreader has a first portion on the controller and a second portion on the memory device, and the heat spreader has a first opening between the first portion and the second portion.