Dimpled Substrate Locating Features for Composite SPR Joining
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Solution Overview
Problem
The challenge in accurately locating self-piercing rivet installation sites, particularly in high-volume production environments, is exacerbated by the limited ductility and brittleness of composite materials like carbon fiber, which complicates the joining process and increases cycle time and equipment complexity.
Innovation Solution
A dimpled substrate with preformed interior cavities and exterior profiles, featuring various locating mechanisms such as surface texturing, laser marking, or notches, is used to identify the precise location for self-piercing rivet installation, enabling accurate positioning and deformation control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-piercing rivet technology is used to join composite materials, then high production volume and efficiency are achieved, but the limited ductility and brittleness of composite materials make accurate locating of rivet installation sites difficult
Solution Approach 1:
The patent applies preliminary action by pre-forming buttons or protrusions on the composite substrate surfaces before rivet installation. These preformed features serve as locating landmarks that guide the automated rivet installation equipment to precise positions, eliminating the need for complex real-time locating systems while maintaining high production volume.
Solution Approach 2:
The patent introduces an intermediary locating feature (button or protrusion) between the composite substrate and the rivet installation process. This intermediary element provides a tangible reference point that bridges the gap between the brittle composite material and the automated installation equipment, enabling precise locating without compromising the substrate's structural integrity.
2Manufacturing precision
If preformed buttons or protrusions are created on brittle composite substrates, then accurate locating of rivet sites is enabled, but the substrates may not have sufficient ductility to form these features
Solution Approach 1:
The patent segments the button formation process from the rivet installation process. Instead of forming buttons through plastic deformation of the composite material, the buttons are created as separate features during substrate manufacturing or through additive processes, eliminating the need for ductility while providing accurate locating features.
Solution Approach 2:
The patent applies partial action by forming only the necessary locating features (buttons or protrusions) without requiring extensive plastic deformation of the entire substrate. This partial formation approach enables locating accuracy while avoiding the excessive deformation that brittle composite materials cannot withstand.
3Stability of the object's composition
If traditional locating methods are used without preformed features, then substrate integrity is maintained, but the cycle time increases and equipment complexity increases in high-volume production settings
Solution Approach 1:
The patent merges the locating feature formation with the substrate manufacturing process. By integrating button or protrusion formation into the initial substrate production, the locating features are created without additional processing steps, maintaining substrate integrity while eliminating extra cycle time in high-volume production environments.
Solution Approach 2:
The patent enables the substrate to serve its own locating function through the preformed buttons or protrusions. These self-provided locating features eliminate the need for external locating equipment or complex positioning systems, reducing equipment complexity and cycle time while maintaining substrate integrity.
Data Source
AI summary
A dimpled substrate for use in an assembly having joined substrates is provided that defines at least one preformed interior cavity, at least one preformed exterior profile adjacent the interior cavity and defining a wall therebetween, and at least one locating feature configured to identify a location of the at least one preformed exterior profile. In one form, the locating feature is disposed in the preformed exterior profile or adjacent to the preformed exterior profile. Alternatively, the locating feature is a notch formed into the dimpled substrate away from the preformed exterior profile.