Diode Array With Solder Barrier For Low Resistance Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Diode arrangements used in high-power applications face challenges with operating reliability due to high power density and temperature, leading to potential short-circuits and inadequate heat dissipation.
Innovation Solution
A diode arrangement with soldered connections on congruent contact surfaces and electrodes with contact extensions, where the electrodes are formed from a conductor material with a solder material barrier, allowing for low transition resistance and enhanced heat dissipation through large surface area electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the contact surface area between diode and electrode is increased to reduce transition resistance, then the transition resistance decreases, but the risk of short-circuits between opposite sides of the diode increases
Solution Approach 1:
A solder material barrier layer is introduced as an intermediary between the solder material contact layer and the diode contact surface. This barrier layer prevents solder material from bridging across the diode contact surfaces, eliminating the short-circuit risk while allowing the contact area to be sufficiently large for low transition resistance.
Solution Approach 2:
The solder material barrier layer is applied in advance before the solder material contact layer. This preliminary action creates a protective barrier that prevents future short-circuits during the soldering process, allowing the design to achieve both large contact area and high reliability.
2Temperature
If electrodes with large surface area are used to improve heat dissipation, then heat dissipation capability increases, but the complexity of electrode formation and alignment increases
Solution Approach 1:
The electrode structure is segmented into distinct functional layers: a conductor material substrate providing mechanical support and thermal mass, a solder material barrier layer for reliable bonding, and a solder material contact layer for electrical and thermal connection. This segmentation allows each layer to be optimized independently, simplifying the overall formation process while achieving large effective heat dissipation area.
3Reliability
If the soldered connection area is reduced to minimize short-circuit risks, then short-circuit risk decreases, but the transition resistance increases
Solution Approach 1:
The solder material barrier layer acts as a mediator that allows the solder material contact layer to maintain a large area for low transition resistance while preventing direct contact between solder material and diode contact surfaces, thus eliminating short-circuit risks even with large connection areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures high operating reliability by minimizing short-circuit risks and enabling effective heat dissipation, maintaining diode performance under high power and temperature conditions.
Implementation Method 1
the contact side of the electrode substrate being furnished with a coating of a solder material barrier having a solder material contact layer applied thereon
Implementation Method 2
the entire surface of a lower side or an upper side of the diode is available for contacting with the electrodes. Thus it is possible to configure the transition resistance between the diode and the electrodes so as to be as low as possible
Data Source
AI summary
A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.