Diode-Bonded Chip Structure for Bonding Defect Voltage Control
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Solution Overview
Problem
Existing electronic devices with metal-to-metal bonded chips face issues due to bonding defects, which can lead to uncontrollable voltages and defects in operations such as electron beam deflection, resulting in undesired irradiation or operational loss.
Innovation Solution
A diode-connected bonding structure is implemented, where a diode is electrically connected with the electrode and bonding parts, allowing for a voltage write operation to identify and adapt to bonding defects by maintaining desired voltages despite defective bonds, ensuring consistent operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal-to-metal bonding is used to connect chips, then electrical connection between chips is achieved, but bonding defects occur leading to uncontrollable voltages and operational failures
Solution Approach 1:
A diode is introduced as an intermediary component between the control circuit and the electrode. This diode acts as a protective mediator that prevents harmful reverse current flow that could occur through defective bonding connections, thereby maintaining system reliability despite the presence of bonding defects
Solution Approach 2:
The diode is configured in reverse bias during normal operation, creating a protective barrier beforehand. When bonding defects occur, this pre-established protective structure prevents voltage失控 and operational failures by blocking abnormal current paths before they can cause harm
2Reliability
If bonding defects are present, then voltage control is lost and operational defects occur, but adding protective structures increases device complexity
Solution Approach 1:
The diode serves multiple functions: during normal operation it maintains reverse bias to prevent leakage current, and when bonding defects occur it blocks abnormal current paths. This single component provides both normal operational functionality and defect protection, avoiding the need for separate protective structures that would increase complexity
3Adaptability or versatility
If diode is added for voltage write operation, then bonding defects can be compensated, but device complexity increases
Solution Approach 1:
The diode configuration enables self-diagnosis and self-compensation capabilities. The voltage write operation uses the diode's inherent properties to detect bonding defects and automatically compensate for them without requiring external intervention or complex additional circuitry, allowing the system to service itself
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains desired voltages across all electrodes, even with bonding defects, preventing undesired electron beam irradiation and operational loss, and enabling reliable switching and electron beam deflection.
Implementation Method 1
a direction from the diode toward the electrode being a forward direction of the diode, a direction from the control circuit toward the diode via the one of the plurality of bonding parts being a reverse direction of the diode
Data Source
AI summary
A first chip includes a first substrate. The first substrate includes a first surface and a control circuit. A second chip includes a second substrate and an electrode. The second substrate includes a second surface facing the first surface. A plurality of bonding parts is located between the first surface and the second surface. One of the plurality of bonding parts electrically connects the control circuit and the electrode. The second substrate includes a diode electrically connected with the electrode and the plurality of bonding parts. A direction from the diode toward the electrode is a forward direction of the diode. A direction from the control circuit toward the diode via the one of the plurality of bonding parts is a reverse direction of the diode.