Diode Laser Assembly With Conductive Microchannel Cooling
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Solution Overview
Problem
Existing diode laser arrangements face limitations in increasing output power due to thickness constraints of busbars used for electrical current supply, which restricts heat dissipation and current intensity, especially when using double-sided cooling methods.
Innovation Solution
A diode laser arrangement with microchannel coolers that have no electrical insulation, allowing for thicker, solid current bridges to supply higher electrical currents, integrated with a DWM module for efficient heat dissipation and compact design, enabling increased output power.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If electrically insulated cooling devices (ILASCO) are used for double-sided cooling of diode laser devices, then heat dissipation is improved, but the thickness of busbars is limited which restricts current intensity and output power
Solution Approach 1:
The system is divided into electrically conductive cooling devices that can be segmented into different functional zones: some regions provide thermal conduction while other regions provide electrical conduction, allowing both cooling and high current supply without interference
Solution Approach 2:
The cooling devices are designed to serve multiple functions: they provide both thermal management (cooling) and electrical current supply through different regions or modes of the same component, eliminating the need for separate insulated cooling devices and thick busbars
2Power
If busbar thickness is increased to supply higher electrical current, then current intensity is improved, but the gap between cooling devices must be increased which complicates the compact design
Solution Approach 1:
The functions of cooling devices and current supply components are merged into a single integrated structure. The cooling devices themselves are made electrically conductive and directly contact the diode laser devices to supply current, eliminating the need for separate busbars and reducing overall device complexity
Solution Approach 2:
The electrical conductivity parameter of the cooling devices is changed from insulating to conductive, fundamentally altering their functionality to simultaneously handle both thermal and electrical loads without requiring increased dimensional parameters
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables significant increases in output power and current density while maintaining effective cooling, reducing heat transfer losses and allowing for a more compact design.
Implementation Method 1
the upper cooling device and the lower cooling device in the at least two stacks are in each case configured to cool the diode laser device arranged therebetween
Implementation Method 2
microchannel coolers that have no electrical insulation, allowing for thicker, solid current bridges to supply higher electrical currents, integrated with a DWM module for efficient heat dissipation
Data Source
AI summary
A diode laser arrangement for the cooling of and supply of electrical current to diode laser devices, having at least two stacks, each having a diode laser device which is configured to emit a laser beam, an upper cooling device, and a lower cooling device. The diode laser device is arranged on the upper cooling device and on the lower cooling device such that the diode laser device is arranged between the upper cooling device and the lower cooling device. The upper and lower cooling devices are in each case electrically connected to the diode laser device arranged therebetween. The upper cooling device and/or the lower cooling device of a stack are in each case formed as a microchannel cooler. The upper cooling device and/or the lower cooling device of a stack in each case have substantially no electrical insulation with respect to the diode laser device arranged therebetween.