Diode Laser Assembly With Parallel Cooling Contact
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Solution Overview
Problem
In diode laser arrangements, inadequate heat transfer due to tolerance-induced gaps between the diode laser device and cooling elements limits output power and service life, and affects beam quality.
Innovation Solution
A diode laser arrangement with a diode laser device and two cooling elements, where a spacing device is used to ensure a large-area contact by aligning the cooling elements parallel to the diode laser device's surfaces, enhancing heat transfer and current distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling elements are arranged close to the diode laser device to maximize contact area, then heat transfer efficiency is improved, but tolerance-induced gaps cause inadequate contact and reduce heat transfer
Solution Approach 1:
The patent introduces a solder layer as an intermediary substance between the cooling elements and the diode laser device. This solder layer fills the tolerance-induced gaps and ensures continuous thermal contact, resolving the contradiction by mediating the interface between components with mismatched dimensions and orientations.
Solution Approach 2:
The patent changes the physical state and properties of the interface material by using solder that melts during assembly. This phase change allows the solder to flow into gaps and conform to the actual surfaces, transforming the contact from rigid geometric matching to fluid-based conformal contact that accommodates manufacturing tolerances.
2Reliability
If thick solder layer is used to fill tolerance gaps, then contact is ensured, but heat transfer is reduced due to solder's lower thermal conductivity
Solution Approach 1:
The patent controls the thickness of the solder layer by precisely controlling the melt quantity applied. By optimizing this parameter, the solder layer becomes thin enough to maintain high thermal conductivity while still being thick enough to fill tolerance gaps and ensure reliable contact between the cooling elements and diode laser device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases output power, ensures long service life, and improves beam quality by maintaining high heat transfer efficiency and reducing temperature-induced shifts in wavelength.
Implementation Method 1
heat is generated which must be dissipated in order to attain a high output power with simultaneously long service life and high beam quality. For this purpose, cooling elements are known which are thermally connected to the diode laser device
Data Source
AI summary
A diode laser arrangement includes a diode laser device, first and second cooling elements and at least one spacing device. The laser device and spacing device are mutually spaced apart between the first and second cooling elements. The laser device and the spacing device are disposed on respective first and second outer surfaces of respective cooling elements. The first and second cooling elements cool the laser device. The laser device has first and second diode main surfaces. The first diode main surface is on the first outer surface in a first front region and/or the second diode main surface is on the second outer surface in a second front region. The spacing device places the first outer surface in the first front region parallel to the first diode main surface, and/or the second outer surface in the second front region parallel to the second diode main surface.