Diode Lighting Module With Cellular Metal Foam Cooling
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Solution Overview
Problem
Existing heat dissipation methods for light-emitting diode or laser diode projectors are inefficient, complex, and costly, often resulting in heat bridges and significant space requirements due to the use of fluid cooling systems with multiple materials and complex setups.
Innovation Solution
A diode lighting module featuring a metal plate with cellular metal foam and a vessel-like structure filled with cooling fluid, where the foam's calibrated holes and vortex effect enhance heat transfer, and a separator divides the fluid flow for efficient heat dissipation without significant matrix modification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cold block systems with compressors and multiple material plates are used for heat dissipation, then heat dissipation effectiveness is improved, but device complexity and weight increase significantly
Solution Approach 1:
The invention extracts and eliminates the complex cold block system with compressor and multiple material plates, replacing it with a simplified liquid cooling system using a single water tank and direct water circulation through the LED board, thereby reducing device complexity while maintaining heat dissipation effectiveness
Solution Approach 2:
The invention introduces water as an intermediary cooling medium that directly contacts the LED board through channels, serving as a simple yet effective heat transfer medium that replaces the complex multi-material cold block system
2Temperature
If cold block systems with multiple material plates are used for heat dissipation, then heat dissipation effectiveness is improved, but weight increases due to heavy materials
Solution Approach 1:
The invention removes the heavy multi-material plate structure and cold block components, replacing them with a lightweight water-based cooling system that achieves comparable or superior heat dissipation with significantly reduced weight
3Temperature
If fluid cooling pipes and multiple plates are used for heat dissipation, then heat dissipation effectiveness is improved, but space requirements increase due to large pipe volume
Solution Approach 1:
The invention merges the cooling function directly into the LED board structure by integrating water channels within the board itself, eliminating the need for separate external pipes and reducing the overall space occupation while maintaining effective heat dissipation
4Temperature
If multiple material plates are stacked for heat dissipation, then heat dissipation effectiveness is improved, but numerous heat bridges are created
Solution Approach 1:
The invention extracts and eliminates the multi-material plate stacking structure that creates heat bridges, replacing it with a homogeneous water-based cooling system that provides uniform heat dissipation without creating thermal shortcuts or heat bridges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides reliable, uniform, and cost-effective heat dissipation, maintaining a constant temperature for diode matrices, optimizing thermal performance and reducing system complexity and weight.
Implementation Method 1
a metal plate having an outside face in contact with said support plate and an inside face supporting a cellular metal foam... for dissipating the heat given off by said diode matrix
Implementation Method 2
an inlet orifice passing through said box to receive a cooling fluid; an outlet orifice for discharging said cooling fluid... the passage from one zone to the other taking place via a cutout in said separator
Implementation Method 3
the cold fluid coming from the cold block enters into an emulsion by a vortex effect, thereby picking up the heat that is given off as well as possible
Data Source
AI summary
A diode lighting module comprising both a diode matrix mounted on a support plate and heat dissipator means for dissipating the heat given off by the diode matrix, includes a metal plate having an outside face in contact with the support plate and an inside face supporting a cellular metal foam including a plurality of calibrated holes passing through each cell in two perpendicular directions, and a vessel-forming box filled with the cellular metal foam and for which the metal plate constitutes a lid. The box has inlet and outlet orifices passing through the box to receive a cooling liquid, and a separator defining two separate cooling fluid flow zones in the cellular metal foam, a cooling fluid feed zone and a cooling fluid discharge zone, with passage from one of the zones to the other taking place through a cutout in the separator.