Diode Mechanical Isolation via Intermediary Support Structure
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Solution Overview
Problem
Diodes in certain applications are prone to mechanical stress, leading to damage and failure when adequate protection is not provided.
Innovation Solution
A diode support structure comprising conductive upper and lower supports electrically coupled to the diode, a mechanical support adjacent to the diode, and an insulator underneath, which protects the diode from mechanical stress by isolating it from external forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If diodes are used in applications with significant mechanical stress, then the diodes can perform their electrical function, but they will be damaged without adequate protection
Solution Approach 1:
The patent introduces a mechanical support structure with insulator material positioned between the diode and the source of mechanical stress. This intermediary structure absorbs and distributes mechanical forces, preventing them from reaching the diode while allowing the diode to maintain its electrical functionality in high-stress applications
Solution Approach 2:
The patent implements protective structures including insulator material and mechanical supports that are positioned in advance to cushion against mechanical stress. These structures are designed to absorb and distribute forces before they can damage the diode, ensuring reliability in applications where mechanical stress is anticipated
2Object-affected harmful factors
If mechanical support structures are added to protect diodes, then mechanical stress protection is improved, but device complexity increases
Solution Approach 1:
The patent designs mechanical support structures that serve multiple functions: providing mechanical stress protection, ensuring electrical isolation through insulator material, and maintaining structural stability. This multi-functionality reduces the need for separate protective components, thereby limiting the increase in device complexity while improving protection
Solution Approach 2:
The patent employs composite structures combining conductive supports with insulator material to achieve both mechanical strength and electrical isolation. This use of composite materials allows a single integrated structure to provide multiple protective functions, reducing overall device complexity compared to using separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support structure effectively isolates diodes from mechanical stress, preventing damage and ensuring their functionality in applications exposed to high mechanical forces.
Implementation Method 1
a mechanical support disposed adjacent to the diode, the conductive upper support and the conductive lower support, and an insulator disposed underneath the mechanical support. In combination, the mechanical support and insulator protect the diode from mechanical stress
Data Source
AI summary
A circuit, comprising a diode, a conductive upper support disposed on top of the diode and electrically coupled to the diode, a conductive lower support disposed underneath the diode and electrically coupled to the diode, a mechanical support disposed adjacent to the diode, the conductive upper support and the conductive lower support, an insulator disposed underneath the mechanical support, an upper terminal coupled to the mechanical support and electrically coupled to the conductive upper support and a lower terminal coupled to the insulator and electrically coupled to the conductive lower support.