Diode Pack Center Stud Anti-Rotation Design
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Solution Overview
Problem
Conventional diode packs face limitations in providing adequate anti-rotation features while maintaining smaller housing form factors due to insufficient polymer flow between the center stud and radial studs during molding.
Innovation Solution
A diode pack design incorporating a center stud captured within the housing with a double D-shaped feature to prevent rotation, along with a Bellville washer for axial bias and a through tube for coolant flow, and using adhesive and O-rings for secure assembly, allowing for smaller form factors while maintaining electrical insulation and thermal contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the gap between the center stud and radial studs is reduced to achieve smaller housing form factors, then the housing size is reduced, but the polymer flow between the center stud and radial studs becomes insufficient during molding
Solution Approach 1:
The patent introduces a separate anti-rotation feature (such as a keyway or protrusion) that divides the bonding task into two independent functions: the polymer provides electrical insulation while the dedicated anti-rotation feature provides mechanical bonding. This segmentation allows the polymer to flow adequately even in reduced gaps without compromising the bonding function.
Solution Approach 2:
The patent introduces an intermediary anti-rotation feature (such as a keyway, protrusion, or mechanical interlock) that acts as a mediator between the center stud and housing. This intermediary element provides the necessary mechanical bonding while allowing the polymer to fulfill its primary insulation function without requiring excessive gap space for flow.
2Strength
If adhesive is used to bond the center stud to the housing, then bonding strength is improved, but the complexity of assembly increases
Solution Approach 1:
The patent combines the anti-rotation feature and bonding function into a single integrated mechanical structure. The anti-rotation feature (such as a keyway or protrusion) provides both mechanical interlocking and bonding strength simultaneously, eliminating the need for separate adhesive application steps and reducing assembly complexity.
Solution Approach 2:
The mechanical anti-rotation feature is designed to provide self-aligning and self-bonding capabilities during assembly. The geometry of the feature (such as a tapered protrusion or snap-fit mechanism) enables automatic positioning and secure attachment without requiring external adhesive materials or complex bonding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively provides anti-rotation features and thermal management within smaller diode pack form factors, enhancing the stability and efficiency of electrical machine components.
Implementation Method 1
at least one Bellville washer within the housing, biasing the center stud in an axial direction against the housing
Implementation Method 2
A layer of adhesive can separate between the housing and the center stud
Implementation Method 3
a through tube in an axial end of the housing opposite the center stud and radial studs. The through tube can include a fluid passage in fluid communication with an interior space of the housing for flow of coolant in thermal contact with the assembly
Implementation Method 4
a sleeve seated about the housing, sealed to the housing by a plurality of O-rings
Data Source
AI summary
A diode pack comprises a plurality of diodes seated in an assembly within a housing. The diode pack also includes a plurality of radial studs extending from an axial end of the housing relative to an axis of rotation extending through the housing. Each of the radial studs is electrically connected to a respective diode within the assembly. The diode pack further includes a center stud captured within the housing between the assembly and the housing and along the axis of rotation. A method of making a diode pack includes forming a housing of an electrically insulate material, removing a portion of the housing along an axis of rotation of the housing, mounting a center stud in the housing where the portion was removed, and assembling an assembly of diodes into the housing.