Dip-Coating Conductive Paste Uniformity Using Ultrasonic Cutting
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Solution Overview
Problem
The existing methods for manufacturing electronic components, such as multilayer ceramic capacitors, inductors, and thermistors, face issues with non-uniform conductive paste layers due to surface tension and sticky string phenomena, leading to uneven external electrode thickness and impaired solder quality.
Innovation Solution
The method involves immersing the electronic component body in a conductive paste layer, forcibly cutting the connection between the paste and the dip layer using a solid or fluid cutter, and then removing excess paste using a paste removal member, which allows for simultaneous shaping and flattening of the conductive paste layer without the need for a conventional blotting step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the electronic component body is raised from the surface plate after dip-coating, then the dip-coating process is completed, but surface tension pulls the conductive paste layer toward the surface plate, reducing film thickness in corner portions
Solution Approach 1:
The patent applies preliminary action by cutting the conductive paste layer with a blade immediately after dip-coating, before the component is fully raised. This preliminary cutting prevents surface tension from pulling the paste toward the surface plate during the raising process, preserving corner portion thickness.
2Manufacturing precision
If a blotting step is implemented to wipe off excess conductive paste, then paste uniformity is improved, but the process requires additional time and steps
Solution Approach 1:
The patent merges the paste removal function with the dip-coating process itself by using a blade to cut the paste layer in-line during the coating operation. This combines what would traditionally be separate dip-coating and blotting steps into a single integrated process, reducing cycle time while maintaining uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a more uniform film thickness on the end surfaces, side surfaces, and corner portions of the electronic components, improving the flatness and stability of the external electrodes, thereby enhancing solder quality and reducing manufacturing time.
Implementation Method 1
the conductive paste layer coated on the end surface of the electronic component body is shaped by bringing it into contact with a wire that vibrates with sound waves, for example, ultrasonic waves
Implementation Method 2
the conductive paste layer of the electronic component body is pulled toward the surface plate due to the surface tension of the conductive paste transferred on the surface plate
Data Source
AI summary
An electronic component manufacturing method comprising: a first step of moving an electronic component body in a first direction relative to a dip layer of a conductive paste to immerse the electronic component body in the dip layer; a second step of moving the electronic component body relative to the dip layer in a second direction that is opposite to the first direction, thereby separating the electronic component body from the dip layer; a third step of forcibly cutting a connection between the conductive paste coated on the end portions of the electronic component body and the dip layer, using a contact with a solid or fluid cutter; and a fourth step of removing excess paste from the conductive paste coated on the end portions of the electronic component body. The third and fourth steps may be conducted simultaneously by cutting and removing the paste with the paste removal member.