Dip-Coating Organic Electronic Devices
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Solution Overview
Problem
There is a need for more cost-efficient liquid deposition methods for producing organic electronic devices, which are essential for their widespread adoption and production.
Innovation Solution
The development of organic electronic devices with at least one dip-coated layer, where the layer thickness can range from 10 nm to 500 nm, utilizing a liquid medium with active materials, and a method involving substrate cleaning to achieve a water contact angle of less than 10 degrees for effective dip-coating, allowing for precise control of layer thickness and pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spin-coating or ink jet printing is used for liquid deposition, then device performance is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent changes the deposition parameters by using dip-coating instead of spin-coating or ink jet printing. This involves modifying the liquid deposition process parameters (deposition method, substrate movement, liquid flow rate) to achieve comparable device performance while reducing manufacturing complexity and cost. The dip-coating method allows for controlled layer formation through simple immersion and withdrawal processes.
Solution Approach 2:
The patent extracts the essential function of liquid deposition from complex spin-coating or ink jet printing systems and implements it through a simpler dip-coating process. By removing unnecessary equipment and process steps while retaining the core liquid deposition capability, the method achieves cost-effective manufacturing without sacrificing device performance.
2Ease of manufacture
If dip-coating is used for liquid deposition, then manufacturing cost is reduced, but layer thickness control precision may worsen
Solution Approach 1:
The patent applies dynamics by controlling the substrate withdrawal speed and angle during dip-coating, as well as the liquid flow rate, to precisely control layer thickness. By making these parameters dynamic and adjustable, the simple dip-coating process achieves precise thickness control (10-500 nm range) comparable to more complex deposition methods.
Solution Approach 2:
The patent implements feedback control by monitoring and adjusting dip-coating parameters (withdrawal speed, liquid flow rate, immersion depth) to achieve consistent layer thickness. This feedback mechanism allows the simple dip-coating process to maintain manufacturing precision while keeping equipment complexity low.
3Reliability
If substrate cleaning is performed to achieve water contact angle less than 10 degrees, then dip-coating effectiveness is improved, but process time increases
Solution Approach 1:
The patent applies preliminary action by performing substrate cleaning and surface treatment before dip-coating to achieve the required water contact angle less than 10 degrees. This preliminary preparation ensures optimal surface energy and wettability, making the subsequent dip-coating process highly effective and reducing the need for rework or additional processing steps.
Solution Approach 2:
The patent changes the surface energy parameters of the substrate through cleaning and treatment processes, achieving a water contact angle less than 10 degrees. This parameter change optimizes the substrate surface for dip-coating, improving layer adhesion and uniformity while allowing for efficient process timing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of organic electronic devices with improved efficiency and performance, as demonstrated by higher current levels and luminance, and comparable device efficiency to spin-coated devices, while offering a cost-effective and scalable manufacturing process.
Implementation Method 1
dip-coating the workpiece into a liquid medium comprising active layer material
Implementation Method 2
cleaning a substrate so that a surface has a water contact angle of less than 10 degrees
Data Source
AI summary
Disclosed are methods of fabricating an organic electronic device, which includes dip coating layers, and the devices made therefrom.